journal article·2023-08

Low‐Power and Field‐Free Perpendicular Magnetic Memory Driven by Topological Insulators

Baoshan Cui, Aitian Chen, Xu Zhang, Bin Fang, Zhaozhuo Zeng, Peng Zhang, Jing Zhang, Wenqing He, Guoqiang Yu, Peng Yan, Xiufeng Han, Kang L. Wang, Xixiang Zhang, Hao Wu

Advanced Materials· Volume 35· Issue 31
Publisher page

Abstract

Abstract Giant spin–orbit torque (SOT) from topological insulators (TIs) has great potential for low‐power SOT‐driven magnetic random‐access memory (SOT‐MRAM). In this work, a functional 3‐terminal SOT‐MRAM device is demonstrated by integrating the TI [(BiSb)2Te3] with perpendicular magnetic tunnel junctions (pMTJs), where the tunneling magnetoresistance is employed for the effective reading method. An ultralow switching current density of 1.5 × 105 A cm−2 is achieved in the TI‐pMTJ device at room temperature, which is 1–2 orders of magnitude lower than that in conventional heavy–metals‐based systems, due to the high SOT efficiency θSH = 1.16 of (BiSb)2Te3. Furthermore, all‐electrical field‐free writing is realized by the synergistic effect of a small spin‐transfer torque current during the SOT. The thermal stability factor (Δ = 66) shows the high retention time (>10 years) of the TI‐pMTJ device. This work sheds light to the future low‐power, high‐density, and high‐endurance/retention magnetic memory technology based on quantum materials.
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Research context

OpenAlex topics: Magnetic properties of thin films · Topological Materials and Phenomena · Advanced Memory and Neural Computing

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Songshan Lake Materials Laboratory Dongguan Guangdong 523808 China

Beijing National Laboratory for Condensed Matter Physics Institute of Physics Chinese Academy of Sciences Beijing 100190 China

Physical Science and Engineering Division King Abdullah University of Science and Technology Thuwal 23955–6900 Saudi Arabia

School of Electronic Science and Engineering and State Key Laboratory of Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu 610054 China

Department of Electrical and Computer Engineering University of California, Los Angeles Los Angeles CA 90095 USA

Funding

National Key Research and Development Program of China · National Natural Science Foundation of China · Army Research Office · King Abdullah University of Science and Technology

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