DataVXAdvanced MaterialsPaper
journal article·2023-08

Near‐Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap‐Filling Adhesives

Lu Chen, Te‐Huan Liu, Xiangze Wang, Yandong Wang, Xiwei Cui, Qingwei Yan, Le Lv, Junfeng Ying, Jingyao Gao, Meng Han, Jinhong Yu, Chengyi Song, Jinwei Gao, Rong Sun, Chen Xue, Nan Jiang, Tao Deng, Kazuhito Nishimura, Ronggui Yang, Cheng‐Te Lin, Wen Dai

Advanced Materials· Volume 35· Issue 31
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Source abstract

Abstract

Abstract The rapid development of highly integrated microelectronic devices causes urgent demands for advanced thermally conductive adhesives (TCAs) to solve the interfacial heat‐transfer issue. Due to their natural 2D structure and isotropic thermal conductivity, metal nanoflakes are promising fillers blended with polymer to develop high‐performance TCAs. However, achieving corresponding TCAs with thermal conductivity over 10 W m−1 K−1 at filler content below 30 vol% remains challenging so far. This longstanding bottleneck is mainly attributed to the fact that most current metal nanoflakes are prepared by “bottom‐up” processes (e.g., solution‐based chemical synthesis) and inevitably contain lattice defects or impurities, resulting in lower intrinsic thermal conductivities, only 20–65% of the theoretical value. Here, a “top‐down” strategy by splitting highly purified Ag foil with nanoscale thickness is adopted to prepare 2D Ag nanoflakes with an intrinsic thermal conductivity of 398.2 W m−1 K−1, reaching 93% of the theoretical value. After directly blending with epoxy, the resultant Ag/epoxy exhibits a thermal conductivity of 15.1 W m−1 K−1 at low filler content of 18.6 vol%. Additionally, in practical microelectronic cooling performance evaluations, the interfacial heat‐transfer efficiency of the Ag/epoxy achieves ≈1.4 times that of the state‐of‐the‐art commercial TCA.
Source: crossref · Quality: baseline

Research context

PolymersNanomaterialsComposites

OpenAlex topics: Thermal properties of materials · Carbon Nanotubes in Composites · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Key Laboratory of Marine Materials and Related Technologies Zhejiang Key Laboratory of Marine Materials and Protective Technologies Ningbo Institute of Materials Technology and Engineering (NIMTE) Chinese Academy of Sciences Ningbo 315201 P. R. China

Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing 100049 P. R. China

School of Energy and Power Engineering Huazhong University of Science and Technology Wuhan Wuhan 430074 P. R. China

Jiangxi Copper Technology Research Institute Co., Ltd. Nanchang Jiangxi 330096 P. R. China

Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology Chinese Academy of Sciences Shenzhen 518055 P. R. China

The State Key Laboratory of Metal Matrix Composites School of Materials Science and Engineering Shanghai Jiao Tong University 800 Dong Chuan Road Shanghai 200240 P. R. China

Guangdong Provincial Key Laboratory of Optical Information Materials and Technology Academy of Advanced Optoelectronics South China Normal University Guangzhou 510006 P. R. China

Guangdong Provincial Engineering Technology Research Center for Transparent Conductive Materials Guangzhou 510006 P. R. China

Advanced Nano‐processing Engineering Lab Mechanical Systems Engineering Kogakuin University Tokyo 192‐0015 Japan

Funding

National Natural Science Foundation of China · Chinese Academy of Sciences · Natural Science Foundation of Ningbo · China Postdoctoral Science Foundation

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