Deposition of Wafer‐Scale Single‐Component and Binary Nanocrystal Superlattice Thin Films Via Dip‐Coating

Single-component and binary nanocrystal superlattices are assembled over wafer-scale areas using the dip-coating method. A series of measurements are performed to confirm superlattice assembly. This study demonstrates the versatility of dip-coating in depositing a diverse set of nanocrystal materials and superlattice structures, while combining large-area deposition with nanoscale control. As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.