journal article·2022-12

Robust and Multifunctional Kirigami Electronics with a Tough and Permeable Aramid Nanofiber Framework

Hongzhen Liu, Hegeng Li, Zuochen Wang, Xi Wei, Hengjia Zhu, Mingze Sun, Yuan Lin, Lizhi Xu

Advanced Materials· Volume 34· Issue 50
Publisher page

Abstract

Abstract Kirigami designs are advantageous for the construction of wearable electronics due to their high stretchability and conformability on the 3D dynamic surfaces of the skin. However, suitable materials technologies that enable robust kirigami devices with desired functionality for skin‐interfaces remain limited. Here, a versatile materials platform based on a composite nanofiber framework (CNFF) is exploited for the engineering of wearable kirigami electronics. The self‐assembled fibrillar network involving aramid nanofibers and poly(vinyl alcohol) combines high toughness, permeability, and manufacturability, which are desirable for the fabrication of hybrid devices. Multiscale simulations are conducted to explain the high fracture resistance of the CNFF‐based kirigami structures and provide essential guidance for the design, which can be further generalized to other kirigami devices. Various microelectronic sensors and electroactive polymers are integrated onto a CNFF‐based materials platform to achieve electrocardiogram (ECG), electromyogram (EMG), skin‐temperature measurements, and measurement of other physiological parameters. These mechanically robust, multifunctional, lightweight, and biocompatible kirigami devices can shed new insights for the development of advanced wearable systems and human–machine interfaces.
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Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Advanced Materials and Mechanics · Supercapacitor Materials and Fabrication

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical Engineering The University of Hong Kong Hong Kong SAR 999077 P. R. China

Advanced Biomedical Instrumentation Centre Limited Hong Kong SAR 999077 P. R. China

Funding

University Grants Committee

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