Covalently Functionalized Leakage‐Free Healable Phase‐Change Interface Materials with Extraordinary High‐Thermal Conductivity and Low‐Thermal Resistance
Source abstract
Abstract
Abstract Phase‐change materials (PCMs) have received considerable attention to take advantage of both pad‐type and grease‐type thermal interface materials (TIMs). However, the critical drawbacks of leaking, non‐recyclability, and low thermal conductivity (κ) hinder industrial applications of PCM TIMs. Here, leakage‐free healable PCM TIMs with extraordinarily high κ and low total thermal resistance (Rt) are reported. The matrix material (OP) is synthesized by covalently functionalizing octadecanol PCM with polyethylene‐co‐methyl acrylate‐co‐glycidyl methacrylate polymer through the nucleophilic epoxy ring opening reaction. The OP changes from semicrystalline to amorphous above the phase‐transition temperature, preventing leaking. The hydrogen‐bond‐forming functional groups in OP enable nearly perfect healing efficiencies in tensile strength (99.7%), κ (97.0%), and Rt (97.4%). Elaborately designed thermally conductive fillers, silver flakes and multiwalled carbon nanotubes decorated with silver nanoparticles (nAgMWNTs), are additionally introduced in the OP matrix (OP‐Ag‐nAgMWNT). The nAgMWNTs bridge silver‐flake islands, resulting in extraordinarily high κ (43.4 W m−1 K−1) and low Rt (30.5 mm2 K W−1) compared with PCM TIMs in the literature. Excellent heat dissipation and recycling demonstration of the OP‐Ag‐nAgMWNT is also carried out using a computer graphic processing unit. The OP‐Ag‐nAgMWNT is a promising future TIM for thermal management of mechanical and electrical devices.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Phase Change Materials Research · Thermal properties of materials · Advanced Thermoelectric Materials and Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Energy Science Sungkyunkwan University Suwon 16419 Republic of Korea
School of Mechanical Engineering Sungkyunkwan University Suwon 16419 Republic of Korea
References (77)
Show source-provided references
1. 10.1038/s41560-022-00986-y10.1038/s41560-022-00986-y ↗
2. 10.1126/sciadv.170034210.1126/sciadv.1700342 ↗
3. 10.1038/nmat306410.1038/nmat3064 ↗
4. 10.1126/science.aat552210.1126/science.aat5522 ↗
5. 10.1002/smll.20210212810.1002/smll.202102128 ↗
6. 10.1016/j.carbon.2019.10.01310.1016/j.carbon.2019.10.013 ↗
7. 10.1002/adfm.20210406210.1002/adfm.202104062 ↗
8. 10.1002/smll.20220069310.1002/smll.202200693 ↗
9. 10.1109/JPROC.2006.87979610.1109/JPROC.2006.879796 ↗
10. 10.1021/acsnano.9b0516310.1021/acsnano.9b05163 ↗
11. Y. F.Pang R. K.Mohammed R. A.Sahan Y.Xia M.Prabhugoud in2010 26th Annu. IEEE Semiconductor Thermal Measurement and Management Symp. (SEMI‐THERM) IEEEPiscataway NJ USA2010 pp. 107–114.10.1109/STHERM.2010.5444307 ↗
12. 10.1021/acsami.1c1127510.1021/acsami.1c11275 ↗
13. 10.1021/acsami.9b1567410.1021/acsami.9b15674 ↗
14. Jaiswal P. · Int. J. Innov. Technol. Creative Eng. · 2011 · 1 · 5
15. 10.1021/acsaem.1c0205210.1021/acsaem.1c02052 ↗
16. 10.1016/j.compscitech.2021.10922310.1016/j.compscitech.2021.109223 ↗
17. 10.1361/10599490177034535810.1361/105994901770345358 ↗
18. F.Sarvar D. C.Whalley P. P.Conway in2006 1st Electronic Systemintegration Technology Conf. IEEE Piscataway NJ USA2006 pp. 1292–1302.10.1109/ESTC.2006.280178 ↗
19. 10.1021/acsami.1c1486210.1021/acsami.1c14862 ↗
20. 10.1038/s41467-022-29090-110.1038/s41467-022-29090-1 ↗
21. 10.1002/adma.20200066010.1002/adma.202000660 ↗
22. 10.1039/C8MH01219A10.1039/C8MH01219A ↗
23. 10.1002/adma.20220245710.1002/adma.202202457 ↗
24. 10.1039/D0TA05247G10.1039/D0TA05247G ↗
25. 10.1002/smll.20210564710.1002/smll.202105647 ↗
26. 10.1016/j.solmat.2022.11183110.1016/j.solmat.2022.111831 ↗
27. 10.1039/C7TA02816D10.1039/C7TA02816D ↗
28. 10.1021/acs.energyfuels.0c0177410.1021/acs.energyfuels.0c01774 ↗
29. 10.1016/j.est.2022.10518010.1016/j.est.2022.105180 ↗
30. 10.1016/j.cej.2022.13996710.1016/j.cej.2022.139967 ↗
31. 10.1039/C7RA11093F10.1039/C7RA11093F ↗
32. 10.1002/anie.20180762210.1002/anie.201807622 ↗
33. 10.1016/j.nanoen.2022.10699110.1016/j.nanoen.2022.106991 ↗
34. 10.1002/adma.20200526310.1002/adma.202005263 ↗
35. 10.3390/ma1423741810.3390/ma14237418 ↗
36. 10.1016/S0032-3861(00)00496-110.1016/S0032-3861(00)00496-1 ↗
37. 10.1002/pen.2467510.1002/pen.24675 ↗
38. 10.1007/s40090-014-0006-810.1007/s40090-014-0006-8 ↗
39. 10.1021/acsami.6b0587310.1021/acsami.6b05873 ↗
40. 10.1016/j.reactfunctpolym.2021.10484710.1016/j.reactfunctpolym.2021.104847 ↗
41. 10.1016/j.solener.2011.08.00210.1016/j.solener.2011.08.002 ↗
42. 10.1016/j.solmat.2011.07.00310.1016/j.solmat.2011.07.003 ↗
43. 10.1021/acsami.7b0008610.1021/acsami.7b00086 ↗
44. 10.1016/j.apenergy.2016.11.04310.1016/j.apenergy.2016.11.043 ↗
45. 10.1002/adma.20160064210.1002/adma.201600642 ↗
46. 10.1016/j.rser.2019.03.02010.1016/j.rser.2019.03.020 ↗
47. 10.1016/j.mattod.2021.04.01210.1016/j.mattod.2021.04.012 ↗
48. 10.1038/nnano.2014.4410.1038/nnano.2014.44 ↗
49. I.Savija J.Culham M.Yovanovich inASME 2003 Int. Electronic Packaging Technical Conf. and Exhibition ASMENew York2003 pp. 567–573.10.1115/IPACK2003-35264 ↗
50. 10.1016/j.solener.2019.11.00710.1016/j.solener.2019.11.007 ↗
51. 10.1016/j.icheatmasstransfer.2021.10555310.1016/j.icheatmasstransfer.2021.105553 ↗
52. 10.1016/j.ijthermalsci.2020.10629310.1016/j.ijthermalsci.2020.106293 ↗
53. 10.1016/j.enconman.2015.05.05010.1016/j.enconman.2015.05.050 ↗
54. 10.1021/jp200838s10.1021/jp200838s ↗
55. 10.1016/j.ijheatmasstransfer.2020.12039310.1016/j.ijheatmasstransfer.2020.120393 ↗
56. 10.1016/j.jcis.2022.04.01710.1016/j.jcis.2022.04.017 ↗
57. 10.1021/acsami.6b1619510.1021/acsami.6b16195 ↗
58. 10.1039/C9TA08368E10.1039/C9TA08368E ↗
59. 10.1038/s41467-021-20931-z10.1038/s41467-021-20931-z ↗
60. 10.1038/s41578-020-0202-410.1038/s41578-020-0202-4 ↗
61. 10.1021/acsomega.1c0046210.1021/acsomega.1c00462 ↗
62. 10.1038/s41578-021-00412-x10.1038/s41578-021-00412-x ↗
63. 10.1002/adfm.20190991210.1002/adfm.201909912 ↗
64. 10.1021/acsami.1c1610510.1021/acsami.1c16105 ↗
65. 10.1039/C5RA03984C10.1039/C5RA03984C ↗
66. 10.1021/acs.macromol.9b0254410.1021/acs.macromol.9b02544 ↗
67. 10.1016/j.carbon.2021.04.05510.1016/j.carbon.2021.04.055 ↗
68. 10.1088/0964-1726/25/8/08401610.1088/0964-1726/25/8/084016 ↗
69. 10.1016/j.compscitech.2019.10791910.1016/j.compscitech.2019.107919 ↗
70. 10.1007/s10118-021-2620-110.1007/s10118-021-2620-1 ↗
71. 10.1039/D1RA09367C10.1039/D1RA09367C ↗
72. 10.1088/1361-665X/aa71f510.1088/1361-665X/aa71f5 ↗
73. 10.1007/s42114-021-00303-310.1007/s42114-021-00303-3 ↗
74. 10.1007/s40820-022-00882-w10.1007/s40820-022-00882-w ↗
75. 10.1016/j.tca.2017.04.01110.1016/j.tca.2017.04.011 ↗
76. 10.1038/s41467-020-15709-810.1038/s41467-020-15709-8 ↗
77. 10.1126/sciadv.abn336510.1126/sciadv.abn3365 ↗