Performance Enhancement of Electronic and Energy Devices via Block Copolymer Self‐Assembly

The use of self‐assembled block copolymers (BCPs) for the fabrication of electronic and energy devices has received a tremendous amount of attention as a non‐traditional approach to patterning integrated circuit elements at nanometer dimensions and densities inaccessible to traditional lithography techniques. The exquisite control over the dimensional features of the self‐assembled nanostructures (i.e., shape, size, and periodicity) is one of the most attractive properties of BCP self‐assembly. Harmonic spatial arrangement of the self‐assembled nanoelements at desired positions on the chip may offer a new strategy for the fabrication of electronic and energy devices. Several recent reports show the great promise in using BCP self‐assembly for practical applications of electronic and energy devices, leading to substantial enhancements of the device performance. Recent progress is summarized here, with regard to the performance enhancements of non‐volatile memory, electrical sensor, and energy devices enabled by directed BCP self‐assembly.