Estimating interfacial interaction energy of Cu-epoxy resin from molecular dynamics simulation
Source abstract
Abstract
Interfacial delamination is one of the typical failure modes in electronic packages. To obtain good reliability of electronic packages, it is important to study the interface properties. In this study, molecular dynamics simulation is conducted to investigate the interfacial interaction energy of Cu-epoxy resin, which is widely used in electronic packages, and the effects of temperature, moisture, crosslink conversion and oxidation degree. The results show that the interaction energy of Cu-epoxy resin is almost independent of the cross-link conversion of the epoxy resin, whereas it is weakened by increasing temperature, moisture and oxidation. Meanwhile, the mechanism of interfacial energy variation is revealed on a molecular scale, which is useful for understanding the interfacial interaction and interfacial delamination.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · High voltage insulation and dielectric phenomena · Material Properties and Processing
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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