Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints
Source abstract
Abstract
Abstract Electromigration (EM) failure in solder joints is a persistent reliability concern, especially in advanced electronic packaging structures. In this study, we conducted an EM experiment on solder joints with asymmetric under-bump-metallization (UBM) thicknesses. Open failure occurred at the solder joint with no current crowding effect but the highest atomic flux of EM, which is related to Sn grain orientation. Our work tries to reveal a counteracting effect of Sn grain orientation on current crowding and the essential reason for the EM failure mechanism of solder joints. Graphical Abstract
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (46)
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