Structural, Dielectric, and Electrical Features of PVA/CMC/PEG Nanocomposite Films Reinforced with ZnMn ₂ O ₄ /CuCo ₂ O ₄ Hybrid Fillers: Frequency and Temperature-Dependent Study

This work investigates the temperature dependence of the dielectric features of PVA/CMC/PEG/(1− x )ZnMn ₂ O ₄ / x CuCo ₂ O ₄ ; x = 0, 0.1, 0.15, 0.2, to apply in numerous applications. The impact of fillers loading on the structure and morphology of the unfilled sample was examined. Filling procedure caused a roughened surface of the doped blends. All samples in the system displayed a semicrystalline nature. The impact of (1− x )ZnMn ₂ O ₄ / x CuCo ₂ O ₄ on the dielectric constant and AC conductivity ( σ _ac ) of the unfilled blended sample. The values of dielectric constant ( ϵ′, ϵ ″) demonstrated elevated magnitudes at lower frequencies, but they diminished fast with increasing frequency. The maximum dielectric constant and AC conductivity were obtained as the host sample contained 10% CuCo ₂ O ₄ . Sample with 20% CuCo ₂ O ₄ has the uppermost energy density value ( U ). The conduction mechanism of different samples was determined. The ϵ ′, ϵ ″, U and σ _ac values rose with temperature. The maximum σ _ac values were recorded when the doped sample contained 10% CuCo ₂ O ₄ . All samples displayed the correlated barrier hopping (CBH) model. This result corroborates the appropriateness of doped blends as effective materials for flexible electronic applications.