journal article·2020-11-01Open access

Novel Band-Edge Work Function Performance Modulation via NPT with PMOS 1st /NMOS 1st Laminated Stack for PMOS Low Power Target

Jiaxin Yao, Huaxiang Yin, Zhenhua Wu, Jinshou Tian

Abstract

In this paper, the band-edge work function performance is systematically investigated and modulated via novel nitrogen plasma treatment (NPT) with the advanced PMOS 1st (TiN/TiN/TiAlC) and NMOS 1st (TiN/TiN) laminated stacks for the fabricated PMOS capacitors. The basic multi-V T performance is strongly modulated by controlling NPT process. 1) Flatband voltage (V FB ) shifts towards band edge are obtained as +120 mV (undiluted), +430 mV (diluted) for PMOS 1st and +80 mV (undiluted), +210 mV (diluted) for NMOS 1st . 2) By manipulating the NPT process from undiluted and diluted case, it can provide significant high band-edge effective work function ranging from 4.89 eV (undiluted) to 5.21 eV (diluted) for PMOS 1st and 5.22 eV (undiluted) to 5.35 eV (diluted) for NMOS 1st laminated stack, respectively. 3) NPT diluted with hydrogen is observed to maintain ultralow bulk trap density (1.11 × 10 11 cm −2 for PMOS 1st and nearly zero for NMOS 1st ) and interface trap density (3.34 × 10 11 eV −1 cm −2 for PMOS 1st and 6.45 × 10 11 eV −1 cm −2 for NMOS 1st ). The significant band-edge work function modulation and very low bulk and interface trap density demonstrate the novel NPT with PMOS 1st /NMOS 1st laminated stack is very promising to achieve the target of PMOS low-power application in the further technology node.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Semiconductor materials and devices · Ferroelectric and Negative Capacitance Devices · Advanced Memory and Neural Computing

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (22)

Show source-provided references
1. Iwai · ECS Trans. · 2017 · 80 · 310.1149/08001.0003ecst ↗
2. Xu · IEEE Trans. Electron Devices · 2015 · 62 · 419910.1109/TED.2015.2494080 ↗
3. Kim · Microelectron. Eng. · 2017 · 178 · 28410.1016/j.mee.2017.05.023 ↗
4. Nayak · IEEE Trans. Electron Devices · 2015 · 62 · 68510.1109/TED.2014.2383352 ↗
5. Yao · IEEE J. Electron Devices Soc. · 2018 · 6 · 84110.1109/JEDS.2018.2858225 ↗
6. Kothari · Appl. Phys. Lett. · 2016 · 10910.1063/1.4961495 ↗
7. Xu · IEEE Trans. Electron Devices · 2018 · 65 · 240010.1109/TED.2018.2823337 ↗
8. Yao · ECS J. Solid State Sci. Technol. · 2018 · 7 · Q15210.1149/2.0221808jss ↗
9. Yao · ECS J. Solid State Sci. Technol. · 2019 · 8 · N110.1149/2.0041901jss ↗
10. Suarez-Segovia · IEEE Electron Device Lett. · 2017 · 38 · 37910.1109/LED.2017.2651644 ↗
11. Tang · IEEE Electron Device Lett. · 2013 · 34 · 148810.1109/LED.2013.2287271 ↗
12. Veloso · Jpn. J. Appl. Phys. · 2014 · 5310.7567/JJAP.53.04EA04 ↗
13. Xu · Solid-State Electronics · 2015 · 115 · 2610.1016/j.sse.2015.09.019 ↗
14. Togo · 2018 · 8110.1109/VLSIT.2018.8510641 ↗
15. Bao · 2018 · 11510.1109/VLSIT.2018.8510650 ↗
16. Yoshida · 2017 · 54110.1109/IEDM.2017.8268439 ↗
17. Ragnarsson · 2016 · 110.1109/VLSIT.2016.7573393 ↗
18. Ragnarsson · 2015 · T14810.1109/VLSIT.2015.7223656 ↗
19. Investigation of TiAlC by atomic layer deposition as N type work function metal for FinFET10.1149/2.0231512jss ↗
20. Investigation of N type metal TiAlC by thermal atomic layer deposition using TiCl4 and TEA as precursors10.1149/2.0291605jss ↗
21. Nicollian · 1982
22. Schroder · 2006