journal article·2016-06

3D Printing of Shape Memory Polymers for Flexible Electronic Devices

Matt Zarek, Michael Layani, Ido Cooperstein, Ela Sachyani, Daniel Cohn, Shlomo Magdassi

Advanced Materials· Volume 28· Issue 22
Publisher page

Abstract

The formation of 3D objects composed of shape memory polymers for flexible electronics is described. Layer-by-layer photopolymerization of methacrylated semicrystalline molten macromonomers by a 3D digital light processing printer enables rapid fabrication of complex objects and imparts shape memory functionality for electrical circuits. As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.
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Research context

OpenAlex topics: Polymer composites and self-healing · Advanced Sensor and Energy Harvesting Materials · Photochromic and Fluorescence Chemistry

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Casali Center of Applied Chemistry Institute of Chemistry The Hebrew University of Jerusalem Jerusalem 91904 Israel

References (34)

Show source-provided references
1. 10.1126/science.106610210.1126/science.1066102 ↗
2. 10.1088/0964-1726/23/2/02300110.1088/0964-1726/23/2/023001 ↗
3. 10.1016/j.matdes.2011.04.06510.1016/j.matdes.2011.04.065 ↗
4. 10.1016/j.tibtech.2013.03.00210.1016/j.tibtech.2013.03.002 ↗
5. 10.1002/adma.20100339810.1002/adma.201003398 ↗
6. 10.1002/adfm.20120021110.1002/adfm.201200211 ↗
7. 10.1126/science.122818310.1126/science.1228183 ↗
8. 10.1002/adma.20147024510.1002/adma.201470245 ↗
9. 10.1002/adma.20147012410.1002/adma.201470124 ↗
10. 10.1002/adma.20130140010.1002/adma.201301400 ↗
11. 10.1002/marc.20150007910.1002/marc.201500079 ↗
12. 10.1016/j.polymer.2014.07.05210.1016/j.polymer.2014.07.052 ↗
13. 10.1039/C3SM52599F10.1039/C3SM52599F ↗
14. 10.1002/adma.20130088010.1002/adma.201300880 ↗
15. 10.1073/pnas.130189511010.1073/pnas.1301895110 ↗
16. Tibbits S. · Archit. Des. · 2014 · 84 · 116
17. 10.1038/srep0742210.1038/srep07422 ↗
18. 10.1063/1.481983710.1063/1.4819837 ↗
19. 10.1088/0964-1726/23/9/09400710.1088/0964-1726/23/9/094007 ↗
20. 10.1016/j.piutam.2014.12.02110.1016/j.piutam.2014.12.021 ↗
21. 10.1021/ma00148a03410.1021/ma00148a034 ↗
22. 10.1126/science.aaa239710.1126/science.aaa2397 ↗
23. 10.1016/j.biomaterials.2007.11.04710.1016/j.biomaterials.2007.11.047 ↗
24. 10.1039/b615954k10.1039/b615954k ↗
25. Flory P. J. · 1953
26. 10.1023/A:102200751035210.1023/A:1022007510352 ↗
27. 10.1186/1475-925X-6-4310.1186/1475-925X-6-43 ↗
28. 10.1016/j.biomaterials.2007.01.03010.1016/j.biomaterials.2007.01.030 ↗
29. 10.1021/nn901868t10.1021/nn901868t ↗
30. M.Hedges M.Kardos B.King M.Renn inProc. Int. Wafer Level Packaging Conf. on Aerosol‐Jet Printing for 3‐D Interconnects Flexible Substrates and Embedded Passives 2006.
31. 10.1002/adma.20140477210.1002/adma.201404772 ↗
32. 10.1021/nn505535k10.1021/nn505535k ↗
33. 10.1002/pola.2059810.1002/pola.20598 ↗
34. 10.1088/0957-4484/23/34/34400310.1088/0957-4484/23/34/344003 ↗