Establishing copper‐zinc alloying strategy via active screen plasma toward stabilized zinc metal anode

Abstract The problematic Zn dendrite for Zn anodes remains a great challenge. Constructing an artificial Cu‐Zn alloy layer is one of the most potential solutions. However, it is still challenging to prepare an ideal Cu‐Zn alloy layer with good morphology and controllable thickness. Herein, a special plasma‐based method of active screen plasma (ASP) is first reported to create a hexagonal close‐packed CuZn₅ alloy layer with controllable morphology and thickness. Meanwhile, a “vaporization‐redeposition” mode is proposed to illustrate the alloying process. Based upon system analysis, the CuZn₅ layer with good uniformity and appropriate thickness can regulate the behavior of Zn‐ion at electrode/electrolyte interface. The former homogenizes the electric field distribution, while the latter enhances de‐solvation ability of Zn‐ion, facilitating Zn‐ion diffusion. Consequently, the CuZn₅‐coated Zn anodes display lower polarization potential and longer cycling life. Such CuZn₅‐coated Zn anodes enable an outstanding cycle stability for Zn‐based devices, and the pouch devices also deliver practicality. image