Tremella‐Inspired Wrinkled 1T‐MoS ₂ @BN for Efficient Thermal Management and Microwave Absorption

ABSTRACT The inherent trade‐off between electrical loss for electromagnetic (EM) absorption and thermal transport for heat management limits optimization of conventional multilayer integrated circuit (IC) packaging architecture. Inspired by the morphological structure of Tremella, we design a wrinkled nanoflower 1T‐MoS ₂ @BN heterostructure, where electrostatic self‐assembly yields intimate coupling between BN nanosheets and 1T‐MoS ₂ to build a multiscale heterogeneous interfacial network. BN introduces efficient phonon pathways that reduce interfacial thermal resistance and strengthen dipole/interfacial polarization, thereby enabling enhanced EM energy dissipation and heat conduction. At 55 vol% loading, the 1T‐MoS ₂ @BN ratio enables tunable multifunctionality: a thermally favored composition (1:1.5) achieves 5.54 W m ^{− 1} K ^{− 1} , while an absorption‐prioritized ratio (1.5:1) delivers −48.8 dB RL _{m i n} with a 3.1 GHz bandwidth at 2.46 mm. This demonstrates an integrated platform balancing thermal and EM performance within one material system. Using this multifunctional composite, the multilayer packaging scheme for conventional radio‐frequency (RF) devices can be streamlined while improving performance. Under near‐field conditions at 5–6 GHz, the shielding effectiveness exceeds 20 dB while continuous thermal pathways rapidly evacuate operating heat, effectively suppressing junction temperature. This heterostructure serves as an ideal model to probe atomic‐scale charge transfer and multidimensional phonon transport, offering a design concept for next‐generation integrated electronics.