DataVXAdvanced Functional MaterialsPaper
journal article·2026-02Open access

Efficient, Non‐Destructive Transfer of Wafer‐Scale Monolayer MoS 2 by Interface Engineering (Adv. Funct. Mater. 12/2026)

Zheng Wei, Yongqing Cai, Jieying Liu, Liyan Zhang, Jiaojiao Zhao, Jian Tang, Lu Li, Qinqin Wang, Huimin Zhang, Zhihua Zhang, Dongxia Shi, Luojun Du

Advanced Functional Materials· Volume 36· Issue 12
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Source abstract

Abstract

Interface Engineering This cover image illustrates efficient, non-destructive transfer of wafer-scale monolayer MoS2 through interface engineering. The visual highlights MoS2 on the surface with a magnifying crystal structure, a PDMS interface, and a sapphire substrate. Lifted films reveal weak substrate bonding, offering new insights toward transfer and device application for 2D materials. More information can be found in the Research Article by Zhihua Zhang, Dongxia Shi, Luojun Du, and co-workers (10.1002/adfm.202517643).
Source: openalex_inverted_index · Quality: baseline

Research context

Nanomaterials

OpenAlex topics: 2D Materials and Applications · Nanowire Synthesis and Applications · Surface and Thin Film Phenomena

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Materials Science and Engineering Dalian Jiaotong University Dalian 116028 China

Beijing National Laboratory for Condensed Matter Physics and Institute of Physics Chinese Academy of Sciences Beijing 100190 China

School of Physical Sciences University of Chinese Academy of Sciences Beijing 100190 China

School of Physics Dalian University of Technology Dalian 116024 China

Songshan Lake Materials Laboratory Dongguan Guangdong 523808 China

Chemistry Analysis & Research Center School of Chemical Engineering Dalian University of Technology Dalian 116024 China

References

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