Efficient Fabrication of Plasmonic Nanostructures Using Chloroform‐Mediated Heterogeneous Bonding

Abstract Plasmonic nanostructures (PNs) have transformed nanophotonics by offering control over electromagnetic waves. Although innovative structural designs have demonstrated PNs' potential, significant fabrication challenges, including the precise alignment of heterogeneous materials, remain. Using chloroform and pre‐UV exposure (PUVE) to enhance adhesion at the metal‐dielectric interface (MDI) addresses these challenges. PUVE preserves plasmon resonance in the MDI, ensuring high performance without compromising structural integrity. Through an annealing process, PUVE strengthens van der Waals bonds, ensuring chloroform molecules remain on the Ag surface during chloroform residue removal, allowing: i) stable preservation of the Ag thin film on the PNs during stripping; and ii) the formation of chloroform‐mediated heterogeneous bonding (CMHB) using energy supplied by UV‐nanoimprint lithography (UV‐NIL). This approach enables PNs' scalable fabrication with enhanced adhesion properties, while CMHB increases adhesion between the UV‐curable resin and Ag, offering scalability to large‐area applications with UV‐NIL. The structural morphology and chemical properties of the fabricated PNs are analyzed using scanning electron microscopy, atomic force microscopy, energy‐dispersive spectroscopy, and X‐ray photoelectron spectroscopy. These PNs demonstrate potential in CCD filters, enhancing optical signal amplification for real‐time imaging at the 785 nm band. This robust fabrication method advances PNs' performance and scalability, advancing nanophotonics and related applications.