Influence of CNT fillers on the thermal, mechanical and shape memory properties of TPI shape memory polymer composites
Source abstract
Abstract
TPI, also known as artificial eucommia rubber, is a thermo-responsive SMP created by molecular recombination and modification with contemporary polymer synthesis and modification techniques. In this paper, TPI shape memory polymer is reinforced with different weight proportions (0, 0.2%, 0.4%, 0.6%, 0.8% and 1%) of carbon nanotube (CNT) and specimens were fabricated with the aim of enhancing the properties of neat TPI polymer composites. Some thermo-mechanical characteristics were investigated and interpreted, including the differential scanning calorimeter (DSC) test, dynamic mechanical analysis (DMA) test, thermal conductivity test, compression test, and a few shape memory properties such as shape recovery ratio and shape recovery rate. TPI shape memory polymers exhibit strong shape memory capabilities and the best mechanical properties based on the testing results for the specimen TPI with 0.8% CNT weight fraction.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Polymer composites and self-healing · Conducting polymers and applications · Silicone and Siloxane Chemistry
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (26)
Show source-provided references
1. [1] Zhao, Q., Qi, H. J., Xie, T., Progress in Polymer Science, 49-50, 79-120 (2015); https://doi.org/10.1016/j.progpolymsci.2015.04.00110.1016/j.progpolymsci.2015.04.001 ↗
2. [2] Liu, Y., Han, C., Tan, H., Du, X., Materials Science and Engineering: A, 527(10), 2510-2514 (2010); https://doi.org/10.1016/j.msea.2009.12.01410.1016/j.msea.2009.12.014 ↗
3. [3] Liu, Y., Gall, K., Dunn, M. L., Greenberg, A. R., Diani, J., International Journal of Plasticity, 22(2), 279-313 (2006); https://doi.org/10.1016/j.ijplas.2005.03.00410.1016/j.ijplas.2005.03.004 ↗
4. [4] Huang, W.M., Ding, Z., Wang, C. C., Wei, J., Zhao, Y., Purnawali, H., Materials Today, 13(7- 8), 54-51 (2010); https://doi.org/10.1016/S1369-7021(10)70128-010.1016/S1369-7021(10)70128-0 ↗
5. [5] L. Sun, T. Wang, H. Chen, A.V. Salvekar, B.S. Naveen, Q. Xu, Y. Weng, X. Guo, Y. Chen, W. Huang, Polymers 11 1049 (2019); https://doi.org/10.3390/polym1106104910.3390/polym11061049 ↗
6. [6] W. Feng, Y. Zhang, Y. Shao, T. Huang, N. Zhang, J. Yang, X. Qi, Y. Wang, European Polymer Journal, 145, 110245 (2021); https://doi.org/10.1016/j.eurpolymj.2020.11024510.1016/j.eurpolymj.2020.110245 ↗
7. [7] Y. Wu, L. Wang, X. Zhao, S. Hou, B. Guo, P.X. Ma, Biomaterials, 104, 18-31 (2016); https://doi.org/10.1016/j.biomaterials.2016.07.01110.1016/j.biomaterials.2016.07.011 ↗
8. [8] Y. Zhang, L. Huang, H. Song, C. Ni, J. Wu, Q. Zhao, T. Xie, ACS Appl. Mater. Interfaces, 11, 32408-32413 (2019); https://doi.org/10.1021/acsami.9b1106210.1021/acsami.9b11062 ↗
9. [9] C. Chen, Y. Liu, X. He, H. Li, Y. Chen, Y. Wei, Y. Zhao, Y. Ma, Z. Chen, X. Zheng, H. Liu, Chemistry of Materials, 33, 987-997 (2021); https://doi.org/10.1021/acs.chemmater.0c0417010.1021/acs.chemmater.0c04170 ↗
10. [10] Tsukada G, Tokuda M, Torii M., The Journal of Endodontics, 40(10),1658-62 (2014); https://doi.org/10.1016/j.joen.2014.05.00310.1016/j.joen.2014.05.003 ↗
11. [11] Xie T, Rousseau IA., Polymer, 50, 1852-6, (2009); https://doi.org/10.1016/j.polymer.2009.02.03510.1016/j.polymer.2009.02.035 ↗
12. [12] Liu YY, Han CM, Tan Huifeng, Du XW., Materials Science and Engineering A, 527, 2510- 2514 (2010); https://doi.org/10.1016/j.msea.2009.12.01410.1016/j.msea.2009.12.014 ↗
13. [13] Qing-Qing Ni, C.-s.Z., Yaqin Fu, Guangze Dai, Teruo Kimura, Composite structures, 81, 176-184, 2007; https://doi.org/10.1016/j.compstruct.2006.08.01710.1016/j.compstruct.2006.08.017 ↗
14. [14] Jianxin Teng, Zhenqing Wang, Jingbiao Liu, Xiaoyu Sun, Polymer Testing, 81, 106257 (2020); https://doi.org/10.1016/j.polymertesting.2019.10625710.1016/j.polymertesting.2019.106257 ↗
15. [15] Guo, Jianming, Wang, Zhenqing, Tong, Liyong, Lv, Hongqing, Liang, Wenyan, Part A: Applied Science and Manufacturing, 76, 162-171. (2015); https://doi.org/10.1016/j.compositesa.2015.05.02610.1016/j.compositesa.2015.05.026 ↗
16. [16] A.R. Chowdhury, J. Jaksik, I. Hussain, Nano-Structures & Nano- Objects 17, 148-184 (2019); https://doi.org/10.1016/j.nanoso.2018.12.00210.1016/j.nanoso.2018.12.002 ↗
17. [17] D. Stoyanova, I. Stambolova, V. Blaskov, Nano-Structures & Nano-Objects, 18, 100301 (2019); https://doi.org/10.1016/j.nanoso.2019.10030110.1016/j.nanoso.2019.100301 ↗
18. [18] Xu, B., Fu, Y. Q., Huang, W. M., Pei, Y. T., Chen, Z. G., De Hosson, J., Reuben, R. L., Polymers,. 2(2), 31-39, (2010); https://doi.org/10.3390/polym202003110.3390/polym2020031 ↗
19. [19] H. Pulikkalparambil, S. Siengchin, J. Parameswaranpillai, Nano-structures & nano-objects, 16, 381-395 (2018); https://doi.org/10.1016/j.nanoso.2018.09.01010.1016/j.nanoso.2018.09.010 ↗
20. [20] Zhang, S.Y., Z., Govender, T., Luo, H., Li, B., Polymer, 49, 3205-3210 (2008); https://doi.org/10.1016/j.polymer.2008.05.03010.1016/j.polymer.2008.05.030 ↗
21. [21] J. T. Fulcher, Y. C. Lu, G. P. Tandon, D. C. Foster, " SPIE Proceedings, 7644. 2010; https://doi.org/10.1117/12.84697410.1117/12.846974 ↗
22. [22] Zhang, X., Li, Q., Holesinger, T. G., Arendt, P. N., Huang, J., Kirven, P. D., Zhu, Y., Advanced Materials, 19(23), 4198-4201, 2007; https://doi.org/10.1002/adma.20070077610.1002/adma.200700776 ↗
23. [23] Yi, Z.; Zhang, J., Zhang, S., Gao, Q., Li, J., Zhang, W., Polymers, 8, 159 (2016); https://doi.org/10.3390/polym805015910.3390/polym8050159 ↗
24. [24] Al-Itry, R., Lamnawar, K., Maazouz, A., Polymers, 7, 939-962 (2015); https://doi.org/10.3390/polym705093910.3390/polym7050939 ↗
25. [25] Guo, J.M., Wang, Z.Q., Composites Part B: Engineering, 76, 162-171, (2015); https://doi.org/10.1016/j.compositesa.2015.05.02610.1016/j.compositesa.2015.05.026 ↗
26. [26] Enliang Wang, Yubing Dong, MD Zahidul Islam, Laiming Yu, Fuyao Liu, Shuaijie Chen, Xiaoming Qi, Yaofeng Zhu, Yaqin Fu, Zhaohe Xu, Ning Hu, Composites Science and Technology, 169, 209-216 (2019); https://doi.org/10.1016/j.compscitech.2018.11.02210.1016/j.compscitech.2018.11.022 ↗