Stretchable and Conductive Aerogel with High Thermal Insulation Through Surface Confinement of Liquid Metal Particles
Source abstract
Abstract
Abstract The progression of wearable electronic devices has highlighted the need for flexible electronics that combine good conductivity with prolonged user comfort. However, simultaneously regulating the thermal and humidity comfort of the human body without compromising electronic performance remains a major challenge. This research introduces a liquid metal‐embedded conductive aerogel (LeCA) to address the challenges of developing flexible circuits with high electrical performance, thermal insulation, and moisture permeability for wearable applications. By employing moisture absorption‐induced phase separation in a thermoplastic polyurethane (TPU) matrix, an asymmetric porous structure is developed that decreases the thermal conductivity of the TPU film and spatially confines liquid metal particles to the upper layer of the TPU film. A direct writing method is demonstrated to facilitate the sintering of liquid metal particles into conductive patterns at targeted regions, resulting in an ease‐of‐fabrication manner for the development of flexible circuits. The findings present LeCA as a promising candidate for the development of wearable devices, combining the essential attributes of conductivity, thermal management, and user comfort in a single, flexible platform.
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Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Nanomaterials and Printing Technologies · Solar-Powered Water Purification Methods
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Biomedical Sciences City University of Hong Kong Hong Kong 999077 P. R. China
School of Energy and Environment City University of Hong Kong Hong Kong 999077 P. R. China
Guangdong Laboratory of Artificial Intelligence and Digital Economy (SZ) Shenzhen 518000 P. R. China
Department of Architecture and Civil Engineering City University of Hong Kong Hong Kong 999077 P. R. China
City University of Hong Kong Shenzhen Research Institute Shenzhen 518000 P. R. China
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