Source abstract
Abstract
Robust microcapsules are prepared with carbon black suspensions high in solids loading (up to 0.2 g/mL) for electrical conductivity restoration. Oxidized carbon black is rendered more hydrophobic through surface functionalization with octadecylamine by two different methods. Functionalization significantly improves dispersability and suspension stability of carbon black in hydrophobic solvents such as o‐dichlorobenzene (o‐DCB), enabling encapsulation by in situ emulsion polymerization. Upon crushing, microcapsules containing functionalized carbon black (FCB) suspensions exhibit significant particle release relative to microcapsules filled with unfunctionalized carbon black. Release of carbon black is further enhanced by the addition of two types of core thickeners, epoxy resin or poly 3‐hexylthiophene (P3HT). Full conductivity restoration (100% restoration efficiency) of damaged silicon anodes is achieved by crushing microcapsules containing FCB suspensions with P3HT. Hydrophobic surface functionalization of carbon black and the addition of core thickeners are both critical for achieving stable microcapsules capable of significant particle release and efficient conductivity restoration.
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Research context
OpenAlex topics: Conducting polymers and applications · Advanced Sensor and Energy Harvesting Materials · Supercapacitor Materials and Fabrication
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Beckman Institute for Advanced Science and Technology, Department of Materials Science and Engineering University of Illinois at Urbana‐Champaign 61801 USA
Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering University of Illinois at Urbana‐Champaign 61801 USA
Beckman Institute for Advanced Science and Technology, Department of Chemistry University of Illinois at Urbana‐Champaign 61801 USA
Beckman Institute for Advanced Science and Technology, Department of Aerospace Engineering University of Illinois at Urbana‐Champaign 61801 USA
References (27)
Show source-provided references
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