A Pyrenylpropyl Phosphonic Acid Surface Modifier for Mitigating the Thermal Resistance of Carbon Nanotube Contacts

Efforts to utilize the high intrinsic thermal conductivity of carbon nanotubes (CNTs) for thermal transport applications, namely for thermal interface materials (TIMs), have been encumbered by the presence of high thermal contact resistances between the CNTs and connecting materials. Here, a pyrenylpropyl‐phosphonic acid surface modifier is synthesized and applied in a straight forward and repeatable approach to reduce the thermal contact resistance between CNTs and metal oxide surfaces. When used to bond nominally vertically aligned multi‐walled CNT forests to Cu oxide surfaces, the modifier facilitates a roughly 9‐fold reduction in the thermal contact resistance over dry contact, enabling CNT‐based TIMs with thermal resistances of 4.6 ± 0.5 mm² K W⁻¹, comparable to conventional metallic solders. Additional experimental characterization of the modifier suggests that it may be used to reduce the electrical resistance of CNT‐metal oxide contacts by similar orders of magnitude.