DataVXAdvanced Functional MaterialsPaper
journal article·2018-03

Transferred, Ultrathin Oxide Bilayers as Biofluid Barriers for Flexible Electronic Implants

Enming Song, Yoon Kyeung Lee, Rui Li, Jinghua Li, Xin Jin, Ki Jun Yu, Zhaoqian Xie, Hui Fang, Yiding Zhong, Haina Du, Jize Zhang, Guanhua Fang, Yerim Kim, Younghee Yoon, Muhammad A. Alam, Yongfeng Mei, Yonggang Huang, John A. Rogers

Advanced Functional Materials· Volume 28· Issue 12
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Source abstract

Abstract

Abstract The work presented here introduces a materials strategy that involves physically transferred, ultrathin layers of silicon dioxide (SiO2) thermally grown on silicon wafers and then coated with hafnium oxide (HfO2) by atomic layer deposition, as barriers that satisfy requirements for even the most challenging flexible electronic devices. Materials and physics aspects of hydrolysis and ionic transport associated with such bilayers define their performance and reliability characteristics. Systematic experimental studies and reactive diffusion modeling suggest that the HfO2 film, even with some density of pinholes, slows dissolution of the underlying SiO2 by orders of magnitude, independent of the concentration of ions in the surrounding biofluids. Accelerated tests that involve immersion in phosphate‐buffered saline solution at a pH of 7.4 and under a constant electrical bias demonstrate that this bilayer barrier can also obstruct the transport of ions that would otherwise cause drifts in the operation of the electronics. Theoretical drift–diffusion modeling defines the coupling of dissolution and ion diffusion, including their effects on device lifetime. Demonstrations of such barriers with passive and active components in thin, flexible electronic test structures highlight the potential advantages for wide applications in chronic biointegrated devices.
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Research context

BiomaterialsMaterials processing

OpenAlex topics: Advanced Memory and Neural Computing · Neuroscience and Neural Engineering · Semiconductor materials and devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science Fudan University Shanghai 200433 P. R. China

Frederick Seitz Materials Research Laboratory Department of Materials Science and Engineering Department of Chemistry University of Illinois at Urbana‐Champaign Urbana IL 61801 USA

State Key Laboratory of Structural Analysis for Industrial Equipment Department of Engineering Mechanics International Research Center for Computational Mechanics Dalian University of Technology Dalian 116024 P. R. China

School of Electrical and Computer Engineering Purdue University West Lafayette IN 47907 USA

School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea

AML, Department of Engineering Mechanics Center for Mechanics and Materials Tsinghua University Beijing 100084 China

Department of Mechanical Engineering Department of Civil and Environmental Engineering and Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA

Department of Electrical and Computer Engineering Northeastern University Boston MA 02115 USA

Department of Materials Science and Engineering Department of Biomedical Engineering Department of Neurological Surgery Department of Chemistry Department of Mechanical Engineering Department of Electrical and Computer Science Center for Bio‐Integrated Electronics Simpson Querrey Institute for Nano/biotechnology Northwestern University Evanston IL 60208 USA

Funding

Defense Advanced Research Projects Agency · China Scholarship Council · National Natural Science Foundation of China · National Institutes of Health · National Science Foundation

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