All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices
Source abstract
Abstract
Abstract Analog in‐memory computing is an emerging paradigm designed to efficiently accelerate deep neural network workloads. Recent advancements have focused on either inference or training acceleration. However, a unified analog in‐memory technology platform–capable of on‐chip training, weight retention, and long‐term inference acceleration–has yet to be reported. This work presents an all‐in‐one analog AI accelerator, combining these capabilities to enable energy‐efficient, continuously adaptable AI systems. The platform leverages an array of analog filamentary conductive‐metal‐oxide (CMO)/HfOx resistive switching memory cells (ReRAM) integrated into the back‐end‐of‐line (BEOL). The array demonstrates reliable resistive switching with voltage amplitudes below 1.5 V, compatible with advanced technology nodes. The array's multi‐bit capability (over 32 stable states) and low programming noise (down to 10 nS) enable a nearly ideal weight transfer process, more than an order of magnitude better than other memristive technologies. Inference performance is validated through matrix‐vector multiplication simulations on a 64 × 64 array, achieving a root‐mean‐square error improvement by a factor of 20 at 1 s and 3 at 10 years after programming, compared to state‐of‐the‐art. Training accuracy closely matching the software equivalent is achieved across different datasets. The CMO/HfOx ReRAM technology lays the foundation for efficient analog systems accelerating both inference and training in deep neural networks.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
IBM Research ‐ Europe Zürich, Rüschlikon 8803 Switzerland
Institut Interdisciplinaire d'Innovation Technologique (3IT) Université de Sherbrooke Sherbrooke Quebec QC J1K 0A5 Canada
Institute of Electronics, Microelectronics and Nanotechnology (IEMN) Université de Lille Villeneuve d'Ascq 59650 France
Funding
Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung · H2020 Leadership in Enabling and Industrial Technologies · H2020 Excellent Science · Horizon 2020 Framework Programme · CHIST-ERA
References (45)
Show source-provided references
1. E.Erdil Data movement bottlenecks to large‐scale model training: Scaling past 1e28 flop 2024 https://epoch.ai/blog/data‐movement‐bottlenecks‐scaling‐past‐1e28‐flop(accessed: June 2024).
2. 10.1145/3140659.308024610.1145/3140659.3080246 ↗
3. V.Sze Y. H.Chen T. J.Yang J. S.Emer arXiv2017.
4. 10.1109/JPROC.2018.287105710.1109/JPROC.2018.2871057 ↗
5. 10.1038/s41565-020-0655-z10.1038/s41565-020-0655-z ↗
6. 10.1016/j.micpro.2019.01.00910.1016/j.micpro.2019.01.009 ↗
7. H.Tsai P.Narayanan S.Jain S.Ambrogio K.Hosokawa M.Ishii C.MacKin C. T.Chen A.Okazaki A.Nomura I.Boybat R.Muralidhar M. M.Frank T.Yasuda A.Friz Y.Kohda A.Chen A.Fasoli M. J.Rasch S.Wozniak J.Luquin V.Narayanan G. W.Burr inProceedings ‐ IEEE International Symposium on Circuits and Systems vol. 2023‐May ISSN 02714310 2023.
8. G. W.Burr R. M.Shelby A.Sebastian S.Kim S.Kim S.Sidler K.Virwani M.Ishii P.Narayanan A.Fumarola L. L.Sanches I.Boybat M.Le Gallo K.Moon J.Woo H.Hwang Y.Leblebici Neuromorphic computing using non‐volatile memory 2017.10.1080/23746149.2016.1259585 ↗
9. 10.1038/s41586-022-04992-810.1038/s41586-022-04992-8 ↗
10. 10.1038/s41586-020-1942-410.1038/s41586-020-1942-4 ↗
11. 10.1038/s41586-023-06337-510.1038/s41586-023-06337-5 ↗
12. 10.1038/s41928-023-01010-110.1038/s41928-023-01010-1 ↗
13. Gemini: A family of highly capable multimodal models 2024 https://arxiv.org/abs/2312.11805.
14. Woo J. · IEEE Nanatechnol. Mag. · 2018 · 12
15. Yin S. · IEEE Trans. Electron Devices · 2020 · 67
16. 10.1186/s11671-020-03299-910.1186/s11671-020-03299-9 ↗
17. J.Tang D.Bishop S.Kim M.Copel T.Gokmen T.Todorov S.Shin K. T.Lee P.Solomon K.Chan W.Haensch J.Rozen inTechnical Digest ‐ International Electron Devices Meeting IEDM vol. 2018‐December ISSN 01631918 2019.
18. Y.Li S.Kim X.Sun P.Solomon T.Gokmen H.Tsai S.Koswatta Z.Ren R.Mo C. C.Yeh W.Haensch E.Leobandung inDigest of Technical Papers ‐ Symposium on VLSI Technology vol. 2018‐June ISSN 07431562 2018.
19. 10.1088/0268-1242/31/6/06300210.1088/0268-1242/31/6/063002 ↗
20. 10.3389/fnins.2016.0033310.3389/fnins.2016.00333 ↗
21. 10.3389/fnins.2020.0010310.3389/fnins.2020.00103 ↗
22. N.Gong M. J.Rasch S. C.Seo A.Gasasira P.Solomon V.Bragaglia S.Consiglio H.Higuchi C.Park K.Brew P.Jamison C.Catano I.Saraf F. F.Athena C.Silvestre X.Liu B.Khan N.Jain S.McDermott R.Johnson I.Estrada‐Raygoza J.Li T.Gokmen N.Li R.Pujari F.Carta H.Miyazoe M. M.Frank D.Koty Q.Yang et al. inTechnical Digest ‐ International Electron Devices Meeting IEDM vol. 2022‐December ISSN 01631918 2022.
23. 10.3389/felec.2023.133128010.3389/felec.2023.1331280 ↗
24. 10.1038/s41467-024-51221-z10.1038/s41467-024-51221-z ↗
25. V.Clerico A.Dutta D. F.Falcone W.Choi M.Galetta T.Stecconi A.Horváth S.Varzandeh B. J.Offrein M.Kaboli V.Bragaglia arXiv2025 https://arxiv.org/abs/2502.18152.
26. 10.1021/acs.nanolett.3c0369710.1021/acs.nanolett.3c03697 ↗
27. D. G. F.Lombardo M. S.Ram T.Stecconi W.Choi A.La Porta D. F.Falcone B.Offrein V.Bragaglia in2024 Device Research Conference (DRC) 2024 pp.1–2.10.1109/DRC61706.2024.10643760 ↗
28. 10.1039/D4NH00072B10.1039/D4NH00072B ↗
29. 10.1109/TED.2015.241811410.1109/TED.2015.2418114 ↗
30. 10.1016/0022-3697(58)90069-610.1016/0022-3697(58)90069-6 ↗
31. A.Padovani L.Larcher P.Padovani C.Cagli B. D.Salvo 2012 4th IEEE International Memory Workshop IMW 20122012 pp.1–4.10.1109/IMW.2012.6213667 ↗
32. 10.1109/LED.2013.225160210.1109/LED.2013.2251602 ↗
33. D. F.Falcone S.Menzel T.Stecconi A.La Porta L.Carraria‐Martinotti B. J.Offrein V.Bragaglia in2023 IEEE International Memory Workshop IMW 2023 ‐ Proceedings2023.
34. M.Galetta D. F.Falcone S.Menzel A.La Porta T.Stecconi W.Choi B. J.Offrein V.Bragaglia in2024 IEEE European Solid‐State Electronics Research Conference (ESSERC)2024 pp.749–752.10.1109/ESSERC62670.2024.10719489 ↗
35. 10.1080/00018732.2022.208400610.1080/00018732.2022.2084006 ↗
36. 10.1038/s41467-020-16108-910.1038/s41467-020-16108-9 ↗
37. H.Tsai S.Ambrogio C.MacKin P.Narayanan R. M.Shelby K.Rocki A.Chen G. W.Burr inDigest of Technical Papers ‐ Symposium on VLSI Technology vol. 2019‐June ISSN 07431562 2019.
38. 10.1109/TED.2018.286535210.1109/TED.2018.2865352 ↗
39. M.Zhao H.Wu B.Gao Q.Zhang W.Wu S.Wang Y.Xi D.Wu N.Deng S.Yu H. Y.Chen H.Qian inTechnical Digest ‐ International Electron Devices Meeting IEDM ISSN 01631918 2018.
40. M. J.Rasch D.Moreda T.Gokmen M.Le Gallo F.Carta C.Goldberg K.El Maghraoui A.Sebastian V.Narayanan in2021 IEEE 3rd International Conference on Artificial Intelligence Circuits and Systems (AICAS) 2021 pp.1–4.10.1109/AICAS51828.2021.9458494 ↗
41. Chen P. · Nat. Commun. · 2023 · 14
42. 10.1038/s41598-018-25376-x10.1038/s41598-018-25376-x ↗
43. 10.1038/s41598-023-42214-x10.1038/s41598-023-42214-x ↗
44. 10.1109/TVLSI.2022.322139010.1109/TVLSI.2022.3221390 ↗
45. 10.1088/0957-4484/23/7/07520110.1088/0957-4484/23/7/075201 ↗