Anisotropic and Heterogeneous Thermal Conductivity in Programmed Liquid Metal Composites Through Direct Ink Writing
Source abstract
Abstract
Abstract Thermal management in electric vehicles, electronics, and robotics requires the systematic ability to dissipate and direct the flow of heat. Thermally conductive soft composites are promising for thermal management due to their high thermal conductivity and mechanical flexibility. However, composites typically have the same microstructure throughout a film, which limits directional and spatial control of thermal management in emerging systems that have distributed heat loads. Herein, directional and spatially tunable thermal properties are programmed into liquid metal (LM) soft composites through a direct ink writing (DIW) process. Through the local control of LM droplet aspect ratio and orientation this programmable LM microstructure has a thermal conductivity in the direction of LM elongation of 9.9 W m−1·K−1, which is ∼40 times higher than the unfilled elastomer (0.24 W m−1·K−1). The DIW process enables LM droplets to be oriented in specific directions with tunable aspect ratios at different locations throughout a continuous film. This introduces anisotropic and heterogeneous thermal conductivity in compliant films to control the direction and magnitude of heat transfer. This methodology and resulting materials can provide designed thermal management solutions for rigid and soft devices.
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Research context
OpenAlex topics: Additive Manufacturing and 3D Printing Technologies · Advanced Sensor and Energy Harvesting Materials · Nanomaterials and Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Mechanical Engineering, Soft Materials and Structures Lab Virginia Tech Blacksburg VA 24061 USA
Mechanical & Materials Engineering, Smart Materials & Robotics Lab University of Nebraska–Lincoln Lincoln NE 68588 USA
Electrical & Computer Engineering University of Nebraska–Lincoln Lincoln NE 68588 USA
School of Computing University of Nebraska–Lincoln Lincoln NE 68588 USA
Macromolecules Innovation Institute Virginia Tech Blacksburg VA 24061 USA
Funding
National Science Foundation
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