Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy (Adv. Funct. Mater. 14/2023)
Source abstract
Abstract
Contact Thermal Resistance In article number 2214071, Kai Wu, Qiang Fu, and co-workers report a joint-inspired interfacial engineering strategy by employing liquid metal to the surface of rigid alumina, which improves material's thermal conductivity and thixotropy. This method will inspire development of high-performance polymer-based thermal interface materials for future advanced electronics.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Aerogels and thermal insulation · Advanced Sensor and Energy Harvesting Materials · Advanced Thermoelectric Materials and Devices
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Affiliations
College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering Sichuan University Chengdu 610065 China
Analytical & Testing Center Sichuan University Chengdu 610065 China
References
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