Self‐Assembly and 3D Printing of SiC_w@MXene/SiOC Metastructure Toward Simultaneously Excellent Terahertz Electromagnetic Interference (EMI) Shielding and Electron‐to‐Thermal Conversion Properties

Abstract The great application potential of terahertz (THz) waves in communication, imaging, and other cutting‐edge fields makes them vulnerable to harsh environments. THz electromagnetic interference (EMI) shielding materials that are applicable in capable of with standing harsh environments are critically important for ensuring the reliable operation of electronic devices and are urgently needed. Herein, UV light‐cured SiC whisker (SiC_w)@MXene/SiOC composites with different SiC_w:MXene mass ratios are developed through electrostatic self‐assembly. The influence of MXene exfoliation routes and SiC_w:MXene mass ratios on the THz EMI shielding performance of SiC_w@MXene/SiOC are investigated in deep. The results indicated that SiC_w@HF‐MXene/SiOC with the SiC_w:MXene mass ratio of 1:1 exhibited the best THz EMI shielding performance, and the abundant heterointerfaces formed between SiC_w and MXene enhanced THz wave attenuation. Subsequently, SiC_w@MXene/SiOC Gyroid triple periodic minimal surface (TPMS) metastructures are fabricated by vat photopolymerization (VPP) 3D printing. All of the obtained metastructures with a thickness of 1.3–2.7 mm exhibited superior THz EMI shielding properties with an average shielding efficiency (SE) of 58.6–66.4 dB in 0.2–1.6 THz. Moreover, the developed Gyroid‐2.5 metastructure even exhibited low thermal conductivity and electron‐to‐thermal conversion properties. The developed Gyroid metastructure facilitates the development of next‐generation THz EMI shielding materials in harsh environments.