DataVXAdvanced Functional MaterialsPaper
journal article·2024-09Open access

Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics

Gwan‐Jin Ko, Heeseok Kang, Won Bae Han, Ankan Dutta, Jeong‐Woong Shin, Tae‐Min Jang, Sungkeun Han, Jun Hyeon Lim, Chan‐Hwi Eom, So Jeong Choi, Yelynn Ryu, Woon‐Hong Yeo, Huanyu Cheng, Suk‐Won Hwang

Advanced Functional Materials· Volume 34· Issue 39
Publisher pageOpen full text
Source abstract

Abstract

Abstract Effective encapsulation is essential for reliable operation of bio‐integrated electronics, particularly those containing dissolvable elements, under humid environments for desired periods of time; however, conventional inorganic or organic encapsulants often suffer from tissue‐incompatible mechanical rigidity and insufficient water‐barrier performance. Here, a mechanically resilient and efficient encapsulation strategy is proposed that can exceed a functional lifetime of state‐of‐the‐art soft encapsulations by several tens of magnitudes. The exceptional protection arises from the high aspect ratio of dissolvable yet impermeable inorganic fillers embedded within biodegradable polymers, which significantly extend the diffusion length of biofluids or water components. Theoretical modeling and experimental analysis elucidate the effects of types, shapes, and concentrations of the fillers on encapsulation performance, as well as mechanical/physical properties. The operation of electronic components under aqueous solutions for prolonged periods demonstrates the practical feasibility of the encapsulation approach for versatile types of soft, biodegradable electronics.
Source: crossref · Quality: baseline

Research context

Polymers

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Electrospun Nanofibers in Biomedical Applications · Surface Modification and Superhydrophobicity

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

KU‐KIST Graduate School of Converging Science and Technology Korea University 145 Anam‐ro, Seongbuk‐gu Seoul 02841 Republic of Korea

Center for Advanced Biomolecular Recognition Biomedical Research Division Korea Institute of Science and Technology (KIST) Seoul 02792 Republic of Korea

IEN Center for Wearable Intelligent Systems and Healthcare Georgia Institute of Technology Atlanta GA 30332 USA

George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA 30332 USA

Department of Engineering Science and Mechanics The Pennsylvania State University University Park PA 16802 USA

Center for Neural Engineering The Pennsylvania State University State College University Park PA 16802 USA

Semiconductor R&D Center Samsung Electronics Co., Ltd Hwaseong‐si Gyeonggi‐do 18448 Republic of Korea

Department of Architecture Korea University 145 Anam‐ro, Seonbuk‐gu Seoul 02841 Republic of Korea

Wallace H. Coulter Department of Biomedical Engineering Georgia Tech and Emory University School of Medicine Atlanta GA 30332 USA

Parker H. Petit Institute for Bioengineering and Biosciences Institute for Materials Institute for Robotics and Intelligent Machines Georgia Institute of Technology Atlanta GA 30332 USA

Department of Materials Science and Engineering The Pennsylvania State University State College University Park PA 16802 USA

Materials Research Institute The Pennsylvania State University State College University Park PA 16802 USA

Center for Biomaterials Biomedical Research Institute Korea Institute of Science and Technology (KIST) 5 Hwarang‐ro 14‐gil, Seongbuk‐gu Seoul 02792 Republic of Korea

Department of Integrative Energy Engineering Korea University 145 Anam‐ro, Seongbuk‐gu Seoul 02841 Republic of Korea

Funding

Ministry of Science and ICT, South Korea · National Research Foundation of Korea · National Institutes of Health

References (38)

Show source-provided references
1. 10.1126/science.122632510.1126/science.1226325 ↗
2. 10.1038/nature1649210.1038/nature16492 ↗
3. 10.1038/s41928-022-00791-110.1038/s41928-022-00791-1 ↗
4. 10.1126/sciadv.aba962410.1126/sciadv.aba9624 ↗
5. 10.1002/adma.20220967310.1002/adma.202209673 ↗
6. 10.1038/s41591-018-0196-210.1038/s41591-018-0196-2 ↗
7. 10.1038/s41467-020-19660-610.1038/s41467-020-19660-6 ↗
8. 10.1038/s41587-021-00948-x10.1038/s41587-021-00948-x ↗
9. 10.1126/science.abm170310.1126/science.abm1703 ↗
10. 10.1021/nl503997m10.1021/nl503997m ↗
11. 10.1038/s41467-023-38040-410.1038/s41467-023-38040-4 ↗
12. 10.1073/pnas.140774311110.1073/pnas.1407743111 ↗
13. 10.1126/sciadv.abb109310.1126/sciadv.abb1093 ↗
14. 10.1038/micronano.2015.2410.1038/micronano.2015.24 ↗
15. 10.1002/adma.20130605010.1002/adma.201306050 ↗
16. 10.1038/s41467-019-13198-y10.1038/s41467-019-13198-y ↗
17. 10.1126/sciadv.150147810.1126/sciadv.1501478 ↗
18. 10.1016/j.nanoen.2018.10.02010.1016/j.nanoen.2018.10.020 ↗
19. 10.1002/adfm.20200094110.1002/adfm.202000941 ↗
20. 10.1016/j.chemosphere.2022.13668310.1016/j.chemosphere.2022.136683 ↗
21. 10.1021/acsnano.1c0546310.1021/acsnano.1c05463 ↗
22. 10.1002/adma.20180189510.1002/adma.201801895 ↗
23. 10.1002/adfm.20130429310.1002/adfm.201304293 ↗
24. 10.1073/pnas.160526911310.1073/pnas.1605269113 ↗
25. R.Sang H.Zhang L.Long Z.Hua J.Yu B.Wei X.Wu T.Feng J.Zhang In2011 12th Int. Conf. on Electronic Packaging Technology and High Density Packaging IEEE New York 2011.
26. 10.1063/5.005083610.1063/5.0050836 ↗
27. 10.1002/adma.20140305110.1002/adma.201403051 ↗
28. 10.1039/D0MH00483A10.1039/D0MH00483A ↗
29. 10.1021/acsnano.3c0306310.1021/acsnano.3c03063 ↗
30. 10.1002/polb.2457410.1002/polb.24574 ↗
31. 10.1002/smll.20130014610.1002/smll.201300146 ↗
32. 10.1155/2011/72415310.1155/2011/724153 ↗
33. 10.1126/sciadv.adf588310.1126/sciadv.adf5883 ↗
34. 10.1016/j.mser.2006.06.00110.1016/j.mser.2006.06.001 ↗
35. 10.1080/1558372070127127810.1080/15583720701271278 ↗
36. 10.1016/j.cej.2023.14620810.1016/j.cej.2023.146208 ↗
37. 10.1038/srep3173510.1038/srep31735 ↗
38. 10.1126/science.107836510.1126/science.1078365 ↗