Source abstract
Abstract
Abstract Despite remarkable advances, high‐performance thermoelectric (TE) materials‐based thermocouples (TCs) lack mechanical robustness and flexibility. Hence, conventional low Seebeck coefficient metals (Ni, Cu, Fe) wire‐junction‐based TCs are used for temperature sensor applications. However, not only the sensitivity of the metal‐based TC sensor is low, but also it is very difficult to fabricate a pixelated sensor using the conventional approach. In this study, high‐performance (SbBi)2(TeSe)3‐based printed flexible TE materials are employed to fabricate two types of shape‐conformable TC‐based temperature sensor arrays with 25 pixels (TSA I and TSA II). Bi0.5Sb1.5Te3‐based p‐type (p‐BST) printed TE film and copper are used to fabricate TSA I, and the p‐type film together with the Bi2Te2.7Se0.3‐based n‐type (n‐BT) film is used to fabricate TSA II. A high average sensitivity (Sexp) value of ≈124 µV °C−1 for TSA I and ≈319 µV °C−1 for TSA II is attained with high linearity.
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Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Advanced Sensor Technologies Research · Thermal Radiation and Cooling Technologies
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Affiliations
Light Technology Institute Karlsruhe Institute of Technology 76131 Karlsruhe Germany
School of Mathematics and Physics Xiamen University Malaysia Jalan Sunsuria, Bandar Sunsuria Sepang Selangor 43900 Malaysia
Department of Physics Faculty of Science Ain Shams University Cairo 11566 Egypt
Laboratory for Electron Microscopy Karlsruhe Institute of Technology 76131 Karlsruhe Germany
Institute of Microstructure Technology Karlsruhe Institute of Technology 76344 Eggenstein‐Leopoldshafen Germany
Funding
Deutsche Forschungsgemeinschaft · Deutsche Bundesstiftung Umwelt · Horizon 2020 Framework Programme
References (24)
Show source-provided references
1. Sanad M. F. · Top Curr. Chem. · 2020 · 48 · 378