Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics

Abstract As a nontoxic and cost‐effective material, copper pastes have attracted great attention in both academia and industry. However, achieving the long‐term stability of copper pastes remains challenging due to their susceptibility to oxidation. Therefore, stable copper nanoparticles with a Cu(0)–Cu(I) core–shell structure containing a surface passivation layer of formate ions‐involved Cu(I) coordination polymers are developed. Based on the self‐reducing nature of the passivation layer, the nanoparticle‐based copper pastes can be sintered in <1 min, showing high electrical conductivity (220 000 S cm⁻¹), mechanical flexibility, and long‐term stability after sintering. The excellent properties of the developed copper pastes are even comparable with the ones of silver pastes. These stable copper pastes have broad applications in printed electronics (e.g., glucose sensors, RFID tags, and electromagnetic shielding films), showing great potential in the fabrication of flexible printed electronics.