journal article·2023-08Open access

Multifunctional Materials Strategies for Enhanced Safety of Wireless, Skin‐Interfaced Bioelectronic Devices

Claire Liu, Jin‐Tae Kim, Da Som Yang, Donghwi Cho, Seonggwang Yoo, Surabhi R. Madhvapathy, Hyoyoung Jeong, Tianyu Yang, Haiwen Luan, Raudel Avila, Jihun Park, Yunyun Wu, Kennedy Bryant, Min Cho, JiYong Lee, Jay Young Kwak, WonHyoung Ryu, Yonggang Huang, Ralph G. Nuzzo, John A. Rogers

Advanced Functional Materials· Volume 33· Issue 34

Abstract

Abstract Many recently developed classes of wireless, skin‐interfaced bioelectronic devices rely on conventional thermoset silicone elastomer materials, such as poly(dimethylsiloxane) (PDMS), as soft encapsulating structures around collections of electronic components, radio frequency antennas and, commonly, rechargeable batteries. In optimized layouts and device designs, these materials provide attractive features, most prominently in their gentle, noninvasive interfaces to the skin even at regions of high curvature and large natural deformations. Past studies, however, overlook opportunities for developing variants of these materials for multimodal means to enhance the safety of the devices against failure modes that range from mechanical damage to thermal runaway. This study presents a self‐healing PDMS dynamic covalent matrix embedded with chemistries that provide thermochromism, mechanochromism, strain‐adaptive stiffening, and thermal insulation, as a collection of attributes relevant to safety. Demonstrations of this materials system and associated encapsulation strategy involve a wireless, skin‐interfaced device that captures mechanoacoustic signatures of health status. The concepts introduced here can apply immediately to many other related bioelectronic devices.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Dielectric materials and actuators · Polymer composites and self-healing

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Querrey Simpson Institute for Bioelectronics Northwestern University Evanston IL 60208 USA

Department of Biomedical Engineering Northwestern University Evanston IL 60208 USA

Advanced Materials Division Korea Research Institute of Chemical Technology Yuseong‐gu Daejeon 34114 Republic of Korea

Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA

Department of Electrical and Computer Engineering University of California Davis Davis CA 95616 USA

Department of Mechanical Engineering Northwestern University Evanston IL 60208 USA

Department of Chemical and Biomolecular Engineering University of Illinois Urbana‐Champaign Urbana IL 61801 USA

School of Mechanical Engineering Yonsei University Seoul 03722 Republic of Korea

Department of Mechanical Engineering University of Minnesota Twin Cities Minneapolis MN 55455 USA

Department of Civil and Environmental Engineering Northwestern University Evanston IL 60208 USA

Department of Chemistry University of Illinois Urbana‐Champaign Urbana IL 61801 USA

Division of Surface and Corrosion Science KTH Royal Institute of Technology Drottning Kristinasväg 51 Stockholm 10044 Sweden

Department of Electrical and Computer Engineering Northwestern University Evanston IL 60208 USA

Funding

National Science Foundation

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