Nanoindentation testing on copper/diamond-like carbon bi-layer films

Abstract In the present work, the effect of indentation load on nano-mechanical properties of copper/diamond-like carbon (Cu/DLC) bi-layer films was explored. In addition, effect of Cu interlayer and influence of self bias on residual stress and various other nano-mechanical properties such as hardness (H) and elastic modulus (E) of Cu/DLC bi-layer films were also discussed. These Cu/DLC bi-layer films were deposited, using hybrid system involving radio frequency (RF)-plasma enhanced chemical vapor deposition and RF-sputtering units, under varied self biases from −125 to −225 V. The effect of penetration depth with varied load from 5 to 20 mN on H and E of these Cu/DLC bi-layer films was also analyzed.