journal article·2024-10Open access

Liquid Metal‐Enhanced Highly Adhesive Electrodes for Multifunctional Epidermal Bioelectronics

Chunyan Cao, Changshun Hou, Xiong Wang, Dong Lv, Liqing Ai, Yaxiu Feng, Peiran Chen, Xuejiao Wang, Mingliang He, Xi Yao

Advanced Functional Materials· Volume 34· Issue 40

Abstract

Abstract Liquid metal (LM) bioelectronics find widespread uses in healthcare devices and medical implants. However, the current LM‐based electrodes suffer from achieving a combination of features including stable conductivity, high tissue adhesion, stability, good biocompatibility, degradability, and recyclability. In this work, a stable LM electrode is prepared with an extremely high adhesion strength (8.9 MPa), which is tunable in a wide range by introducing an adhesive ureidopyrimidinone (UPy)‐based polymer to harvest the abovementioned properties. With the help of dynamic LM particle‐polymer interactions in the polymer matrix, LMs can not only enhance the adhesion properties but also form a percolated network at a low LM loading (38 vol%) to achieve a high conductance stability (R/R0 = 0.76 at 100% strain). The high adhesion strength provides a highly stable electrical connection with rigid components with a high stretchability of 1154% when mounting a resistor, while a relatively low adhesion makes it a comfortable wounded skin‐interfaced electrode for accelerating wound healing. Taking advantage of their tunable surface adhesion and biocompatibility, the as‐prepared LM electrodes provide a more reliable and friendly approach to the development of healthcare devices.
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Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications · Nanomaterials and Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Biomedical Sciences City University of Hong Kong Kowloon, Hong Kong 999077 P. R. China

City University of Hong Kong Shenzhen Research Institute Shenzhen 518000 P. R. China

Funding

Shenzhen Knowledge Innovation Program · Innovation and Technology Fund

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