AlScN‐on‐SiC Thin Film Micromachined Resonant Transducers Operating in High‐Temperature Environment up to 600 °C
Source abstract
Abstract
Abstract The experimental demonstration of aluminum scandium nitride (AlScN)‐on‐cubic silicon carbide (SiC) heterostructure thin film micromachined resonant transducers operating in a high‐temperature environment up to 600 °C is reported. Macroscopic and microscopic vibrations are investigated through a combination of ultrasensitive laser interferometry techniques and Raman spectroscopy. An average linear temperature coefficient of resonance frequency (TCf) of <1 ppm °C−1 within the temperature range from room temperature to 200 °C, and an average linear TCf of −16 ppm °C−1 between 200 and 600 °C, from the fundamental‐mode resonance of AlScN/SiC circular diaphragm resonator with a thickness of 1.9 µm and diameter of 250 µm, is obtained. Higher‐order modes exhibit much larger TCf, which make them strong candidates as high‐temperature‐tolerant temperature sensors or ultraviolet detectors. Raman spectroscopy indicates that the turning points of the peak positions of the longitudinal optical phonon modes of both 3C‐SiC and AlScN occur in almost the same temperature region where the turnover point of TCf is observed, suggesting that the microscopic vibrations in the crystal lattice and the macroscopic oscillation of the diaphragm are naturally mediated by the residual strain inside the materials at varying temperature.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Acoustic Wave Resonator Technologies · Mechanical and Optical Resonators · GaN-based semiconductor devices and materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Electrical and Computer Engineering Herbert Wertheim College of Engineering University of Florida Gainesville FL 32611 USA
Department of Electrical Engineering & Computer Science University of Michigan Ann Arbor MI 48109 USA
NASA Jet Propulsion Laboratory California Institute of Technology Pasadena CA 91109 USA
Funding
Defense Threat Reduction Agency · Army Research Office
References (51)
Show source-provided references
1. 10.1109/JMEMS.2014.231926610.1109/JMEMS.2014.2319266 ↗
2. Feng P. X.‐L. · 2017 · 395
3. 10.1016/j.snb.2007.10.06410.1016/j.snb.2007.10.064 ↗
4. 10.1109/7361.98346910.1109/7361.983469 ↗
5. 10.4028/www.scientific.net/AMM.643.7210.4028/www.scientific.net/AMM.643.72 ↗
6. 10.1109/JMEMS.2019.292391910.1109/JMEMS.2019.2923919 ↗
7. 10.1016/j.egypro.2015.03.27910.1016/j.egypro.2015.03.279 ↗
8. 10.1016/S0142-9612(02)00007-810.1016/S0142-9612(02)00007-8 ↗
9. 10.1088/1742-6596/660/1/01213710.1088/1742-6596/660/1/012137 ↗
10. Brown T. G. · IEEE Sens. · 2003 · 2 · 753
11. 10.1109/JMEMS.2021.308970310.1109/JMEMS.2021.3089703 ↗
12. 10.1063/1.506378210.1063/1.5063782 ↗
13. 10.1088/0960-1317/17/7/S1210.1088/0960-1317/17/7/S12 ↗
14. 10.1016/j.sna.2006.03.00110.1016/j.sna.2006.03.001 ↗
15. 10.1016/j.jeurceramsoc.2005.08.01110.1016/j.jeurceramsoc.2005.08.011 ↗
16. 10.1063/1.349578210.1063/1.3495782 ↗
17. 10.1016/j.surfcoat.2016.11.08310.1016/j.surfcoat.2016.11.083 ↗
18. 10.1002/adma.20080261110.1002/adma.200802611 ↗
19. 10.1143/APEX.1.06110410.1143/APEX.1.061104 ↗
20. 10.1002/adma.20170255710.1002/adma.201702557 ↗
21. 10.1038/srep0641610.1038/srep06416 ↗
22. 10.1007/s11664-017-5924-810.1007/s11664-017-5924-8 ↗
23. B. A.Griffin S. D.Habermehl P. J.Clews inProc. Sensors for Extreme Harsh Environments SPIE Sensing Technology and Applications Baltimore Maryland United States2014.
24. 10.1016/j.jcrysgro.2007.10.01710.1016/j.jcrysgro.2007.10.017 ↗
25. 10.1002/adma.20080261110.1002/adma.200802611 ↗
26. F.Ayazi L.Sorenson R.Tabrizian inProc. Micro‐ and Nanotechnology Sensors Systems and Applications III Vol.8031 SPIE May2011 pp.371–383.10.1117/12.884731 ↗
27. 10.1002/adem.20170085810.1002/adem.201700858 ↗
28. Noraini M. · Int. J. Nanoelectron. · 2020 · 13 · 113
29. 10.1109/5.70426510.1109/5.704265 ↗
30. 10.1063/5.000494310.1063/5.0004943 ↗
31. 10.1088/0960-1317/26/7/07500610.1088/0960-1317/26/7/075006 ↗
32. V. J.Gokhale B. P.Downey M. T.Hardy E. N.Jin J. A.Roussos D. J.Meyer presented atProc. IEEE 33thInt. Conf. Micro Electro Mech. Syst. (MEMS) Jan.2020.
33. 10.1109/TUFFC.2013.260610.1109/TUFFC.2013.2606 ↗
34. 10.1063/1.348136110.1063/1.3481361 ↗
35. M.Rinaldi A.Tazzoli J.Segovia‐Fernandez V.Felmetsger G.Piazza presented atProc. IEEE 25thInt. Conf. Micro Electro Mech. Syst. (MEMS) Paris France Feb. 2012.
36. 10.1109/JMEMS.2006.88601210.1109/JMEMS.2006.886012 ↗
37. 10.1088/0022-3727/40/11/01210.1088/0022-3727/40/11/012 ↗
38. 10.1109/JMEMS.2020.302078710.1109/JMEMS.2020.3020787 ↗
39. 10.1250/ast.30.34810.1250/ast.30.348 ↗
40. Talwar D. N. · J. Mater. Sci. Eng. · 2017 · 6 · 2169
41. 10.1063/1.240493810.1063/1.2404938 ↗
42. 10.1016/j.mejo.2008.06.05310.1016/j.mejo.2008.06.053 ↗
43. 10.1016/S0022-0248(99)00581-310.1016/S0022-0248(99)00581-3 ↗
44. 10.1063/1.486103410.1063/1.4861034 ↗
45. 10.1063/5.002736410.1063/5.0027364 ↗
46. 10.1021/acsami.1c0291210.1021/acsami.1c02912 ↗
47. 10.1063/1.140927810.1063/1.1409278 ↗
48. 10.1016/j.apsusc.2005.04.02010.1016/j.apsusc.2005.04.020 ↗
49. 10.1103/PhysRevB.28.192810.1103/PhysRevB.28.1928 ↗
50. 10.1021/jp068502810.1021/jp0685028 ↗
51. 10.1002/pssb.20100070410.1002/pssb.201000704 ↗