Lantern‐Inspired On‐Skin Helical Interconnects for Epidermal Electronic Sensors
Source abstract
Abstract
Abstract Epidermal electronics have been attracting considerable attention due to their various potential applications in human‐computer interaction and health monitoring. However, because of the lack of a self‐adhesive and stable interconnect method between epidermal electronic sensors and rigid circuit boards, there remain difficulties in detecting body signals accurately by epidermal electronic sensors in daily life. Here, a 3D helical on‐skin interconnect is first introduced for epidermal electronics sensors. Inspired by the structure of the accordion lantern, the interconnect is composed of two electrospinning polyurethane (PU) fiber films and a helical metal fiber. The helical metal fiber acts as a stable conductor with stretchability, and the PU fiber film with polydimethylsiloxane provides a self‐adhesive substrate. Mechanical simulations and tests prove that the proposed interconnect can laminate conformally and unobtrusively onto human skin with excellent electrical stability (less than 0.5% electrical resistance change upon 100% elongation). Furthermore, based on the proposed interconnect, an all‐in‐one sensor‐interconnect design is presented, which endows the epidermal electronic systems with anti‐motion interference capability. A gesture identification wristband system realized by a single all‐in‐one strain sensor is demonstrated. Besides, a wireless on‐skin system that accurately monitors dynamic 12‐lead electrocardiographic is successfully built using all‐in‐one electrodes.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications · Tactile and Sensory Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Integrated Circuit Tsinghua University Beijing 100084 P. R. China
Beijing National Research Center for Information Science and Technology (BNRist) Tsinghua University Beijing 100084 P. R. China
Center for Flexible Electronics Technology Tsinghua University Beijing 100084 P. R. China
Funding
National Natural Science Foundation of China
References (58)
Show source-provided references
1. 10.1126/sciadv.abi456310.1126/sciadv.abi4563 ↗
2. 10.1126/science.120615710.1126/science.1206157 ↗
3. 10.1016/j.bios.2020.11240410.1016/j.bios.2020.112404 ↗
4. 10.1126/science.aau078010.1126/science.aau0780 ↗
5. 10.1038/nature2100410.1038/nature21004 ↗
6. 10.1021/acsnano.7b0218210.1021/acsnano.7b02182 ↗
7. 10.1002/adma.20190576710.1002/adma.201905767 ↗
8. 10.1002/smll.20210647710.1002/smll.202106477 ↗
9. 10.1002/adfm.20190316210.1002/adfm.201903162 ↗
10. 10.1038/s41928-020-0422-z10.1038/s41928-020-0422-z ↗
11. 10.1038/s41467-020-14988-510.1038/s41467-020-14988-5 ↗
12. 10.1038/s41528-021-00119-710.1038/s41528-021-00119-7 ↗
13. 10.1038/s41467-022-33457-910.1038/s41467-022-33457-9 ↗
14. 10.1038/s41928-020-00510-810.1038/s41928-020-00510-8 ↗
15. 10.1038/s41467-020-16268-810.1038/s41467-020-16268-8 ↗
16. 10.1126/sciadv.abg918010.1126/sciadv.abg9180 ↗
17. 10.1038/s41467-021-22192-210.1038/s41467-021-22192-2 ↗
18. 10.1038/s41551-021-00763-410.1038/s41551-021-00763-4 ↗
19. 10.1038/s41467-022-34406-210.1038/s41467-022-34406-2 ↗
20. 10.1016/j.tsf.2010.10.06910.1016/j.tsf.2010.10.069 ↗
21. 10.1115/1.403910210.1115/1.4039102 ↗
22. 10.1115/1.404523710.1115/1.4045237 ↗
23. 10.1038/nnano.2011.18410.1038/nnano.2011.184 ↗
24. 10.1038/nmat490410.1038/nmat4904 ↗
25. 10.1002/adma.20180010910.1002/adma.201800109 ↗
26. 10.1002/adma.20190344610.1002/adma.201903446 ↗
27. 10.1038/s41467-021-21916-810.1038/s41467-021-21916-8 ↗
28. 10.1002/adfm.20220487810.1002/adfm.202204878 ↗
29. 10.1038/nnano.2017.12510.1038/nnano.2017.125 ↗
30. 10.1021/acsnano.8b0424510.1021/acsnano.8b04245 ↗
31. 10.1039/D0NR03189E10.1039/D0NR03189E ↗
32. 10.1021/acsami.0c2239710.1021/acsami.0c22397 ↗
33. 10.1002/adfm.20130295710.1002/adfm.201302957 ↗
34. 10.1002/admt.20180016910.1002/admt.201800169 ↗
35. 10.1126/sciadv.abd099610.1126/sciadv.abd0996 ↗
36. 10.1126/sciadv.abm378510.1126/sciadv.abm3785 ↗
37. 10.1038/am.2014.8810.1038/am.2014.88 ↗
38. 10.1039/C8TC01183D10.1039/C8TC01183D ↗
39. 10.1038/ncomms1589410.1038/ncomms15894 ↗
40. 10.1002/adhm.20210022110.1002/adhm.202100221 ↗
41. 10.1021/acsami.0c1914910.1021/acsami.0c19149 ↗
42. 10.1073/pnas.211190411810.1073/pnas.2111904118 ↗
43. 10.1021/acsmaterialslett.0c0020310.1021/acsmaterialslett.0c00203 ↗
44. 10.1126/science.abc973510.1126/science.abc9735 ↗
45. 10.1002/adma.20210248810.1002/adma.202102488 ↗
46. 10.1002/admt.20210134810.1002/admt.202101348 ↗
47. 10.1038/s41427-020-00267-810.1038/s41427-020-00267-8 ↗
48. 10.1016/S0032-3861(02)00136-210.1016/S0032-3861(02)00136-2 ↗
49. 10.1007/BF0271682010.1007/BF02716820 ↗
50. 10.1016/j.jmbbm.2012.06.01810.1016/j.jmbbm.2012.06.018 ↗
51. 10.1038/s41551-018-0261-710.1038/s41551-018-0261-7 ↗
52. 10.1038/s41528-021-00126-810.1038/s41528-021-00126-8 ↗
53. 10.1016/j.compscitech.2018.01.01910.1016/j.compscitech.2018.01.019 ↗
54. 10.1002/adma.20190749510.1002/adma.201907495 ↗
55. 10.1002/adma.20220079310.1002/adma.202200793 ↗
56. 10.1021/acsami.0c1765810.1021/acsami.0c17658 ↗
57. 10.1021/acsami.0c0299110.1021/acsami.0c02991 ↗
58. 10.1088/0967-3334/17/2/00310.1088/0967-3334/17/2/003 ↗