journal article·2019-04

Behavior of Al/Cu/Ti electrodes in surface acoustic wave filter at high power

Qi Li, Sulei Fu, Zengtian Lu, Lirong Qian, Rui Wang, Tongjin Chen, Cheng Song, Fei Zeng, Weibiao Wang, Feng Pan

Current Applied Physics· Volume 19· Issue 4
Publisher page

Abstract

Abstract Driven by the need for high data-rates and continuous reduction in device size, surface acoustic wave filters are required to work under increasingly high power. In this work, a series of 2.7 GHz surface acoustic wave filters with Al/Cu/Ti three-layered electrode were fabricated and loaded with high power. Those three-layered electrodes showed weaker texture but higher stability than Al-Cu alloy electrode at high power. Morphologies, microstructures and elements distribution in cross section of fingers were analyzed carefully before and after high power loading. Results show that the circular-arc-shaped outline of fingers were appeared in most samples after high power loading, and the number of gains in the finger cross section changed from some into several with much larger volume. The features of distribution of Cu atoms also coincided with these microstructures. By finite element method and phase diagram analysis, the higher stability of Al/Cu/Ti three-layered electrodes are attributed to precipitation of θ-CuAl2 in the bottom edge of electrode finger and Cu-doped α-Al in the center top.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Aluminum Alloys Composites Properties · Advanced Welding Techniques Analysis · Acoustic Wave Resonator Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (24)

Show source-provided references
1. A bright outlook for acoustic filtering: a new generation of very low-profile SAW, TC-SAW, and BAW devices for module integration10.1109/MMM.2015.2429512 ↗
2. Metal-migration of aluminum film on SAW resonator10.1002/ecja.4400671113 ↗
3. Design and characterization of SAW filters for high power performance
4. Impact of composition and structure of Al alloy electrodes to power durability of SAW devices
5. Analysis of heat dissipation improvement using bonded wafer in Chip Size SAW Device structure
6. Enhanced stress durability of nano resonators with scandium doped electrodes10.1016/j.matchar.2010.06.018 ↗
7. Impact of SAW device passivation on RF performance10.1109/58.949745 ↗
8. High power durability of diamond surface acoustic wave filter10.1109/58.656643 ↗
9. The power durability of 900 MHz band double-mode-type surface acoustic wave filters and improvement in power durability of Al–Cu thin film electrodes by Cu atom segregation10.1143/JJAP.36.3101 ↗
10. Texture-enhanced Al-Cu electrodes on ultrathin Ti buffer layers for high-power durable 2.6 GHz SAW filters10.1063/1.5017091 ↗
11. High power SAW filter with new Al-Sc-Cu/Ti/Al-Sc-Cu/Ti electrodes
12. High power durable electrodes for GHz band SAW duplexers
13. Challenges in metal recycling10.1126/science.1217501 ↗
14. Significant enhancement in electromigration resistance and texture of aluminum films using an ultrathin titanium underlayer10.1016/j.actamat.2013.04.032 ↗
15. Correlation between texture and mechanical stress durability of thin aluminum films10.1016/j.tsf.2014.01.003 ↗
16. Enhanced power durability of surface acoustic wave filter with Al/Ti/Cu/Ti electrodes10.1016/j.jallcom.2018.01.049 ↗
17. Steady-state and transient thermal modeling for a SAW duplexer
18. Improvement in power durability of SAW filters
19. Improved power durability of surface acoustic wave filters for an antenna duplexers10.1143/JJAP.34.2688 ↗
20. COMSOL modeling of SAW resonators
21. Experimental observations of stress-driven grain boundary migration10.1126/science.1178226 ↗
22. Grain rotations in ultrafine-grained aluminum films studied using in situ TEM straining with automated crystal orientation mapping10.1016/j.matdes.2016.10.015 ↗
23. Grain size stabilization and strengthening of cryomilled nanostructured Cu 12 at% Al alloy10.1016/j.jallcom.2017.05.093 ↗
24. Atomistic study of fundamental character and motion of dislocations in intermetallic Al2Cu10.1016/j.ijplas.2016.09.005 ↗