Laboratory-Based Nano-Computed Tomography and Examples of Its Application in the Field of Materials Research
Source abstract
Abstract
In a comprehensive study, we demonstrate the performance and typical application scenarios for laboratory-based nano-computed tomography in materials research on various samples. Specifically, we focus on a projection magnification system with a nano focus source. The imaging resolution is quantified with common 2D test structures and validated in 3D applications by means of the Fourier Shell Correlation. As representative application examples from nowadays material research, we show metallization processes in multilayer integrated circuits, aging in lithium battery electrodes, and volumetric of metallic sub-micrometer fillers of composites. Thus, the laboratory system provides the unique possibility to image non-destructively structures in the range of 170–190 nanometers, even for high-density materials.
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Research context
OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Advanced Electron Microscopy Techniques and Applications · Nuclear Physics and Applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Experimental Physics (X-ray Microscopy), University of Würzburg, 97074 Würzburg, Germany
Nano-Tomography Group, Fraunhofer Development Center X-ray Technology EZRT, 97074 Würzburg, Germany
Center Smart Materials and Adaptive Systems, Fraunhofer Institute for Silicate Research ISC, 97082 Würzburg, Germany
References (47)
Show source-provided references
1. New directions in X-ray microscopy10.1080/00107514.2011.589662 ↗
2. Nanoscale X-ray imaging10.1038/nphoton.2010.267 ↗
3. Hybrid setup for micro- and nano-computed tomography in the hard X-ray range10.1063/1.5011042 ↗
4. (2020, August 27). TriLambda 40nm X-ray Microscope—Sigray. Available online: http://www.sigray.com/trilambda.
5. (2020, August 27). ZEISS Xradia 810 Ultra—Highest Spatial Resolution Lab-Based XRM. Available online: https://www.zeiss.com/microscopy/int/products/x-ray-microscopy/xradia-810-ultra.html.
6. A laboratory X-ray microscopy setup using a field emission electron source and micro-structured reflection targets10.1016/j.nimb.2013.12.028 ↗
7. First Results on Laboratory Nano-CT with a Needle Reflection Target and an Adapted Toolchain
8. New Type of X-Ray Source for Lensless Laboratory Nano-CT with 50-nm Resolution10.1117/12.860340 ↗
9. NanoXCT: Development of a laboratory nano-CT system
10. (2020, August 27). NanoTube N2 60 kV—Excillum. Available online: https://www.excillum.com/products/nanotube/nanotube-n2-60kv/.
11. Implementation of a Computed Tomography System based on a laboratory-based nanofocus X-ray source10.1017/S1431927618013521 ↗
12. Myoanatomy of the velvet worm leg revealed by laboratory-based nanofocus X-ray source tomography10.1073/pnas.1710742114 ↗
13. Aryan, P., Sampath, S., and Sohn, H. (2018). An overview of non-destructive testing methods for integrated circuit packaging inspection. Sensors, 18.10.3390/s18071981 ↗
14. An overview of through-silicon-via technology and manufacturing challenges10.1016/j.mee.2014.10.019 ↗
15. Micheloni, R., Crippa, L., Zambelli, C., and Olivo, P. (2017). Architectural and integration options for 3D NAND flash memories. Computers, 6.10.3390/computers6030027 ↗
16. (2020, August 27). Tech Brief: Memory “Grows Up” with 3D NAND|Lam Research. Available online: https://blog.lamresearch.com/tech-brief-memory-grows-up-with-3d-nand/.
17. (2020, August 27). Overcoming Challenges in 3D NAND Volume Manufacturing|Lam Research. Available online: https://blog.lamresearch.com/overcoming-challenges-in-3d-nand-volume-manufacturing/.
18. Tanaka, H., Kido, M., Yahashi, K., Oomura, M., Katsumata, R., Kito, M., Fukuzumi, Y., Sato, M., Nagata, Y., and Matsuoka, Y. (2007, January 12–14). Bit Cost Scalable Technology with and Plug Process for Ultra High Density Flash Memory. Proceedings of the Digest of Technical Papers—Symposium on VLSI Technology, Kyoto, Japan.10.1109/VLSIT.2007.4339708 ↗
19. 3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections10.1147/JRD.2008.5388567 ↗
20. Measuring thermally induced void growth in conformally filled through-silicon vias (TSVs) by laboratory x-ray microscopy10.1117/12.916599 ↗
21. Sekhar, V.N., Neo, S., Yu, L.H., Trigg, A.D., and Kuo, C.C. (2010, January 8–10). Non-destructive testing of a high dense small dimension through silicon via (TSV) array structures by using 3D X-ray computed tomography method (CT scan). Proceedings of the 2010 12th Electronics Packaging Technology Conference, EPTC 2010, Singapore.10.1109/EPTC.2010.5702683 ↗
22. Gambino, J.P., Bowe, W., Bronson, D.M., and Adderly, S.A. (2014). Imaging of through-silicon vias using X-Ray computed tomography. Proc. Int. Symp. Phys. Fail. Anal. Integr. Circuits IPFA, 327–331.10.1109/IPFA.2014.6898170 ↗
23. Nowakowski, P., Ray, M., Fischione, P., and Sagar, J. (2017, January 15–18). Top-down delayering by low energy, broad-beam, argon ion milling—A solution for microelectronic device process control and failure analyses. Proceedings of the 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), Saratoga Springs, NY, USA.10.1109/ASMC.2017.7969206 ↗
24. In situ/operando synchrotron-based X-ray techniques for lithium-ion battery research10.1038/s41427-018-0056-z ↗
25. Quantification of Heterogeneous Degradation in Li-Ion Batteries10.1002/aenm.201900674 ↗
26. Heterogeneous damage in Li-ion batteries: Experimental analysis and theoretical modeling10.1016/j.jmps.2019.05.003 ↗
27. Dielectric Elastomers with Novel Highly-Conducting Electrodes10.1117/12.2012492 ↗
28. Electrical and mechanical behavior of filled elastome. I. The effect of strain10.1002/polb.10571 ↗
29. Electrical and mechanical behavior of filled rubber. III. Dynamic loading and the rate of recovery10.1002/polb.20452 ↗
30. Electron tomography provides a direct link between the Payne effect and the inter-particle spacing of rubber composites10.1038/srep07389 ↗
31. Lenseless X-ray nano-tomography down to 150 nm resolution: On the quantification of modulation transfer and focal spot of the lab-based ntCT system10.1088/1748-0221/16/01/P01034 ↗
32. (2020, December 28). EIGER2 R for Laboratory—Dectris. Available online: https://www.dectris.com/products/eiger2/eiger2-r-for-laboratory/.
33. Transforming X-ray detection with hybrid photon counting detectors
34. Spectral response characterization of CdTe sensors of different pixel size with the IBEX ASIC10.1016/j.nima.2018.03.006 ↗
35. Roberts, T.J., and Kaplan, D.M. (2007, January 25–19). G4beamline simulation program for matter-dominated beamlines. Proceedings of the 2007 IEEE Particle Accelerator Conference (PAC), Albuquerque, NM, USA.10.1109/PAC.2007.4440461 ↗
36. GEANT4—A simulation toolkit10.1016/S0168-9002(03)01368-8 ↗
37. Auto-calibration of cone beam geometries from arbitrary rotating markers using a vector geometry formulation of projection matrices10.1088/1361-6560/abe75f ↗
38. van Heel, M., and Schatz, M. (2017). Reassessing the Revolution’s Resolutions. BioRxiv, 224402.10.1101/224402 ↗
39. (2021, February 09). Image Science—FSC Program. Available online: https://www.imagescience.de/fsc.html.
40. Fourier shell correlation threshold criteria10.1016/j.jsb.2005.05.009 ↗
41. (2020, August 27). Toshiba: News Release (4 August 2015): Toshiba Develops World’s First 256Gb, 48-layer BiCS FLASHTM. Available online: https://www.toshiba.co.jp/about/press/2015_08/pr0401.htm.
42. (2020, August 27). Toshiba and SanDisk Announce 48-layer 256Gbit TLC 3D NAND. Available online: https://www.anandtech.com/show/9490/toshiba-and-sandisk-announce-48layer-256gbit-tlc-3d-nand.
43. Microstructural feature analysis of commercial Li-ion battery cathodes by focused ion beam tomography10.1016/j.jpowsour.2019.04.019 ↗
44. The ImageJ ecosystem: An open platform for biomedical image analysis10.1002/mrd.22489 ↗
45. (2020, August 27). 3D NAND: Challenges beyond 96-Layer Memory Arrays|Coventor. Available online: https://www.coventor.com/blog/3d-nand-challenges-beyond-96-layer-memory-arrays/.
46. Overcoming challenges in 3D NAND volume manufacturing
47. (2020, August 27). Advanced Patterning Techniques For 3D NAND Devices. Available online: https://semiengineering.com/advanced-patterning-techniques-for-3d-nand-devices/.