Stresses and deformation processes in thin films on substrates
Source abstract
Abstract
Abstract The stresses that develop in thin films on substrates can be detrimental to the reliability of thin film electronic devices. In order to design these devices for improved mechanical reliability, an understanding of the origin of these stresses and the controlling deformation processes in thin films is needed. This review begins with a discussion of the basic techniques used for measuring stresses in thin films and for studying the mechanical properties of thin films. The proposed models for the origin of stresses in thin films are then reviewed. Finally, the effects of microstructure and substrate constraint on thin film deformation processes are discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Semiconductor materials and devices · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (100+)
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