Low Loss Chip‐to‐Chip Couplers for High‐Density Co‐Packaged Optics
Source abstract
Abstract
Co-Packaged Optics In article number 2402095, Drew Weninger, Samuel Serna, and co-workers present a co-packaged optics system with an electrical chip (black, center) surrounded by 8 silicon photonic chips. Chips are bonded using an automated pick-and-place tool, shown placing the final chip into position. The automation is enabled by a novel optical chip-to-chip coupler (green callout).
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Semiconductor Lasers and Optical Devices · Photonic and Optical Devices · Semiconductor Quantum Structures and Devices
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Affiliations
Department of Materials Science and Engineering Massachusetts Institute of Technology 77 Massachusetts Ave Cambridge 02139 MA USA
Department of Physics, Photonics, and Optical Engineering Bridgewater State University 131 Summer St Bridgewater 02324 MA USA
Materials Research Laboratory Massachusetts Institute of Technology 77 Massachusetts Ave Cambridge 02139 MA USA
References
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