Contents: Adv. Eng. Mater. 2∕2016
Source abstract
Abstract
The cover shows an ultrafi ne-grained pure copper with an average grain size of 250 nm after HPT processing through 10 turns. The present research confi rms that there is an excellent potential for using the UFG pure copper for applications in micro-forming technology. Further details can be found in the article by J. Xu, T. G. Langdon and co-workers on page 241.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Microstructure and mechanical properties · Advanced materials and composites · Metallurgical and Alloy Processes
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References
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