Evaluation of Lead Free Soldering Development by Means of a Holistic Consideration
Source abstract
Abstract
Engineering is still mainly oriented towards step‐by‐step‐processes. Due to ongoing challenges such as increasing complexity or shortened time for product developments, connections and correlations have to be understood and used as an important part of work in engineering practice as well as in research. Therefore, a tool derived form a holistic model based on a material approach is explained. The subject of lead‐free electronic soldering is taken for illustrating its practical use and potential.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Engineering and Materials Science Studies · Advancements in Materials Engineering
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References (4)
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