Local Fatigue in Lead‐Free SnAg3.8Cu0.7 Solder
Source abstract
Abstract
It has been shown that in thin SnAg3.8Cu0.7 solder samples, strain concentration in shear bands is the dominant mechanism of fatigue damage. The development of degradation results from the interplay of lattice defect accumulation and recrystallization. Localized recrystallization is assumed to enhance the lifetime of the samples. Line patterns superimposed by FIB are useful in tracking the deformation and in localizing slip planes in the solder.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (18)
Show source-provided references
1. The European Parliament and Commission The restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)2003.
2. 10.1007/s11664-005-0074-910.1007/s11664-005-0074-9 ↗
3. 10.1109/TCAPT.2003.81508910.1109/TCAPT.2003.815089 ↗
4. J. Liang N. Dariavach P. Callahan et al. InterPack 052005.
5. 10.1007/s11664-005-0265-410.1007/s11664-005-0265-4 ↗
6. 10.1002/adem.20050004810.1002/adem.200500048 ↗
7. 10.1016/S0921-5093(02)00461-610.1016/S0921-5093(02)00461-6 ↗
8. 10.1016/j.msea.2004.10.04310.1016/j.msea.2004.10.043 ↗
9. 10.1007/s11664-002-0100-010.1007/s11664-002-0100-0 ↗
10. 10.1007/s11664-001-0148-210.1007/s11664-001-0148-2 ↗
11. 10.1016/j.tsf.2004.05.03710.1016/j.tsf.2004.05.037 ↗
12. 10.1007/s11664-002-0161-010.1007/s11664-002-0161-0 ↗
13. Bird J. E. · ASM Trans. Q. · 1969 · 62 · 155
14. 10.1109/33.20692510.1109/33.206925 ↗
15. 10.1016/0025-5416(79)90164-210.1016/0025-5416(79)90164-2 ↗
16. 10.1557/JMR.2004.022210.1557/JMR.2004.0222 ↗
17. 10.1007/s11664-004-0096-810.1007/s11664-004-0096-8 ↗
18. 10.2320/matertrans.45.138310.2320/matertrans.45.1383 ↗