In Situ and Ex Situ Nanomechanical Analysis of Reactive Nanolayer Solder Joints
Source abstract
Abstract
The nanomechanical behavior of NiAl derived from explosively RNLs in reactive solder joints is studied using in situ nanocompression and nanoindentation. We report the direct analysis of <011> slip and discuss the role it plays in the much disputed ductility of NiAl. The hardness, modulus, and residual stress in the NiAl layer are studied by load-displacement curve analysis.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Intermetallics and Advanced Alloy Properties · Energetic Materials and Combustion
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References (17)
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