Bonding Low‐density Nanoporous Metal Foams Using Sputtered Solder
Source abstract
Abstract
A method has been developed to bond low-density nanoporous copper foam components to an aluminum substrate using solder that is sputtered onto the surfaces. After assembling the components together and heating them to melt the solder, they were joined together by a layer of solder with a thickness of less than 2 μm.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Nanoporous metals and alloys · Anodic Oxide Films and Nanostructures · Corrosion Behavior and Inhibition
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (17)
Show source-provided references
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