Novel Crosslinking of High‐order and Multiple Copper Twins in Advanced Microelectronics Packaging
Source abstract
Abstract
Novel crosslinking of high‐order and multiple copper twins has been formed in the metallization/solder interconnect subjected to the thermal aging. This surprising finding may illustrate a universal metallization failure mode. Meanwhile, many copper nanocrystals in situ originated from those twins crosslinking shed a novel light on the synthesis approach to fascinating nanocrystalline metals.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Aluminum Alloys Composites Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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