Determination of Deformation Induced by Thin Film Residual Stress in Structures of Millimeter Size
Source abstract
Abstract
The deformation of Si/SiNx based square membrane structures are measured by Makyoh topography. The results are compared to finite-element modelling of the structure, and the thermal expansion coefficient of SiNx is extracted.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Copper Interconnects and Reliability · Nanofabrication and Lithography Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.