Study of a Line‐Patterning Process Using Impact Print‐Type Hot Embossing Technology
Source abstract
Abstract
An impact print‐type hot embossing process is a method for creating arbitrary patterns on polymer film in real‐time. This process can form 20–100 μm dot patterns and line patterns using an impact head and a high‐precision moving stage on a polymer film such as polyester (PET) film, polymethyl methacrylate (PMMA) film, polyvinyl chloride (PVC) film without the need for the embossing stamps used for conventional hot embossing processes. This technology can also create line patterns with varying widths and depths by adjusting the positions of the impact header. Moreover, the proposed process can be used to fabricate electrical channels of various widths and depths to install ultrafine electronic devices. Because the proposed method can create ultrafine patterns in real‐time, using it can reduce the cost and time required for pattern modifications and process replacements. In addition, from the result of the bending test after applying the conductive ink to the line pattern, it is known that this process is suitable for making the flexible electrical channel. The advantages of this line‐patterning method will contribute significantly to the current field of hot embossing to create ultrafine patterns by enabling small‐quantity production of various types of products while also facilitating mass production.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Nanofabrication and Lithography Techniques · Advancements in Photolithography Techniques · Advanced Surface Polishing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Robotics Engineering Daegu Gyeongbuk Institute of Science and Technology (DGIST) 333 Techno Jungang-daero, Hyeonpung, Dalseong-gun Daegu 42988 Republic of Korea
References (34)
Show source-provided references
1. Weigel M. · Proc. ACM Interact. Mobile Wearable Ubiquitous Technol. · 2017 · 1 · 28
2. 10.21595/jme.2017.1922310.21595/jme.2017.19223 ↗
3. S.-Y.Lee Y.-T.Han J.-H.Kim Y.-H.Ko H.-D.Jung J.-S.Choe C.-J.Youn W.-S.Han S.-T.Kim Y.Baek presented at 2018 Optical Fiber Communications Conference and Exposition 2018 (OFC 2018) March2018 San Diego.
4. 10.1063/1.367557410.1063/1.3675574 ↗
5. 10.7736/KSPE.2017.34.3.19910.7736/KSPE.2017.34.3.199 ↗
6. Nguyen L. · Aust. J. Mech. Eng. · 2017 · 1
7. 10.1016/j.jmatprotec.2017.11.04010.1016/j.jmatprotec.2017.11.040 ↗
8. 10.1016/j.mee.2018.02.02210.1016/j.mee.2018.02.022 ↗
9. 10.1016/j.materresbull.2017.03.01010.1016/j.materresbull.2017.03.010 ↗
10. 10.3390/mi801002910.3390/mi8010029 ↗
11. 10.1364/OE.23.02097710.1364/OE.23.020977 ↗
12. 10.1007/s12206-015-1108-810.1007/s12206-015-1108-8 ↗
13. 10.1364/OE.23.00515410.1364/OE.23.005154 ↗
14. 10.1039/C6LC01430E10.1039/C6LC01430E ↗
15. 10.1002/adma.20060088210.1002/adma.200600882 ↗
16. 10.1007/s00542-017-3299-710.1007/s00542-017-3299-7 ↗
17. 10.1002/adma.20070265010.1002/adma.200702650 ↗
18. 10.1021/nn900363310.1021/nn9003633 ↗
19. 10.1088/0960-1317/25/12/12501410.1088/0960-1317/25/12/125014 ↗
20. 10.1002/adem.20170020110.1002/adem.201700201 ↗
21. 10.1007/s00170-015-7244-610.1007/s00170-015-7244-6 ↗
22. 10.1088/0960-1317/25/3/03502910.1088/0960-1317/25/3/035029 ↗
23. 10.1007/s12540-010-1013-810.1007/s12540-010-1013-8 ↗
24. 10.1007/s00170-015-7507-210.1007/s00170-015-7507-2 ↗
25. 10.1016/j.mee.2016.05.02310.1016/j.mee.2016.05.023 ↗
26. 10.1039/C6LC00215C10.1039/C6LC00215C ↗
27. 10.1002/adem.20180038610.1002/adem.201800386 ↗
28. 10.1002/adma.20170502410.1002/adma.201705024 ↗
29. 10.1038/ncomms814910.1038/ncomms8149 ↗
30. 10.1016/S0924-4247(00)00296-X10.1016/S0924-4247(00)00296-X ↗
31. b)F.Omar Ph.D. Thesis Cardiff University Cardiff Wales United Kingdom2013;
32. 10.1088/0960-1317/24/1/01300110.1088/0960-1317/24/1/013001 ↗
33. 10.1088/0960-1317/20/1/01501710.1088/0960-1317/20/1/015017 ↗
34. J.Ahn D.Yun in2019 Int. Conf. on Robotics and Automation 2019 (ICRA 2019) IEEE Montreal May2019 p.5565.10.1109/ICRA.2019.8793518 ↗