Micromachining by Focused Ion Beam (FIB) for Materials Characterization
Source abstract
Abstract
Surface patterning was investigated first to analyze the creep behavior of lead‐free solder and second to optimize FIB milling parameters. It was found that surface patterning, consisting of thin ion etched lines and dots, is a useful method to quantify local deformation. Concerning the milling parameters redeposition was found to be a crucial point for the FIB micro‐ and nanometer 3D structuring.
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Research context
OpenAlex topics: Metal and Thin Film Mechanics · Advanced Surface Polishing Techniques · Integrated Circuits and Semiconductor Failure Analysis
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References (9)
Show source-provided references
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