Mechanical Behavior and Adhesion of the Ti/Cr/Au Metallization Scheme on Diamond Substrate

The mechanical properties of a Ti/Cr/Au metallization system deposited on a heavily doped diamond substrate are evaluated, first using nano‐indentation tests. Various kinds of conditions are adopted, such as small and high force loadings. These tests are completed by in situ scanning electron microscopy observations of the surface. The adhesion of such multilayer on the diamond substrate is assessed using nano‐scratching tests. The profiles of the obtained scratches are analyzed to detect any singularities or defects. Finally, a cross‐section topography is performed, in order to obtain the cross profile of the scratch, and to determine the scratch hardness parameter of the metallization system. The Ti/Cr/Au metallization system is a potential candidate to play the role of ohmic contact on diamond. Therefore, its adhesion to diamond is important, since the whole power electronic assembly is mainly subjected to thermal cycling during service. The metallization system must adhere well to diamond, so as to resist temperature gradients and thermal strains that are widely observed in extreme thermal conditions. Otherwise, debonding phenomena may occur, and the whole electronic packaging fail.