Insight into the Microstructure and Tensile Behavior of the W–Cu Composite Reinforced with Tungsten Fibers and Particulates

Herein, the microstructure and tensile property of the tungsten fiber (W_f)‐reinforced W–Cu composite are investigated by both experimental and simulation methods. An electron backscattering diffraction (EBSD) analysis reveals the elongated <110> textured grains in the W_f compared with the matrix part, ensuring the small quantities of the grain boundaries along the direction perpendicular to the tensile direction. Tensile tests further confirm its improved strength by ≈8.0% (526.8 ± 5.3 MPa) compared with the composite without inserted W_f, with a satisfactory tensile strain of 5.9 ± 0.3%. Based on the fractography observation and finite‐element analysis, typically stable energy dissipation behavior of the composite is considered to be ascribed to the interactive competition between complex fracture modes, including frictional fiber pullout, elastic bridging, interface debonding, and crack deflection.