Heat Sink Material Selection in Electronic Devices by Computational Approach
Source abstract
Abstract
Due to the increasing complexity and higher density of components in modern devices, reliability and lifetime are important issues in electronic packaging. Many material solutions have been suggested and tested for the reliability optimisation of electronic devices. This study presents methodical and numerical approaches for the selection of composite materials and compares the results of different actual solutions in terms of static and fatigue criteria.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Mechanical Behavior of Composites · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (12)
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