Interaction of Grain Boundaries and Particles in Uncooperative Migration
Source abstract
Abstract
The ubiquitous motion of grain boundaries is responsible for determining the unique microstructural patterns and stability of polycrystalline materials. By employing the versatile multi‐phase field modeling methodology, the role of inert second‐phase particles on the dynamics of grain boundaries under conditions of uncooperative migration is analyzed. Systematic studies are carried out to understand the influence of various particle shapes on the motion of the grain boundaries with a particular attention put on the interfacial interactions. It is found that the motion of the grain boundaries is impeded by pinning effects exerted by these particles. The ability of the moving boundaries to pass through particles of distinct morphologies is different, with the simulation results showing a big influence of particle alignment and the aspect ratio on the pinning of grain boundaries. The results suggest that elongated and flat‐type spheroid particles are more likely to preserve the grain structure by reducing coarsening significantly.
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Research context
OpenAlex topics: Microstructure and mechanical properties · Aluminum Alloy Microstructure Properties · Solidification and crystal growth phenomena
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Chemical & Materials Engineering University of Nevada, Reno Reno NV 89557 USA
Department of Industrial and Manufacturing Systems Engineering Iowa State University Ames IA 50011 USA
References (38)
Show source-provided references
1. Belger A. · Mater. Sci. Appl. · 2012 · 3 · 185
2. 10.1016/S1359-6454(99)00285-210.1016/S1359-6454(99)00285-2 ↗
3. 10.1533/9780857091123.backmatter10.1533/9780857091123.backmatter ↗
4. 10.1016/j.scriptamat.2004.06.00210.1016/j.scriptamat.2004.06.002 ↗
5. 10.1038/1921280b010.1038/1921280b0 ↗
6. 10.1179/cmq.1962.1.2.18710.1179/cmq.1962.1.2.187 ↗
7. 10.1016/j.actamat.2009.01.00310.1016/j.actamat.2009.01.003 ↗
8. 10.1016/j.actamat.2004.07.03210.1016/j.actamat.2004.07.032 ↗
9. 10.1016/0001-6160(62)90092-510.1016/0001-6160(62)90092-5 ↗
10. 10.1016/j.actamat.2018.09.03810.1016/j.actamat.2018.09.038 ↗
11. 10.1016/j.commatsci.2014.03.05410.1016/j.commatsci.2014.03.054 ↗
12. 10.1088/1361-651X/abe0a710.1088/1361-651X/abe0a7 ↗
13. 10.1080/09506608.2016.125753610.1080/09506608.2016.1257536 ↗
14. 10.1016/S0921-5093(97)00435-810.1016/S0921-5093(97)00435-8 ↗
15. 10.1016/S1359-6454(97)00048-710.1016/S1359-6454(97)00048-7 ↗
16. 10.1016/S1359-6454(99)00069-510.1016/S1359-6454(99)00069-5 ↗
17. 10.1002/adem.20200049010.1002/adem.202000490 ↗
18. 10.1007/s10853-019-04307-910.1007/s10853-019-04307-9 ↗
19. 10.1016/j.pepi.2018.08.00410.1016/j.pepi.2018.08.004 ↗
20. 10.1016/j.actamat.2020.02.04310.1016/j.actamat.2020.02.043 ↗
21. 10.1080/09276440.2018.143962510.1080/09276440.2018.1439625 ↗
22. Moelans N. · Arch. Metall. Mater. · 2008 · 53 · 1149
23. 10.1007/978-3-319-19440-0_2010.1007/978-3-319-19440-0_20 ↗
24. 10.1088/0965-0393/23/4/04500910.1088/0965-0393/23/4/045009 ↗
25. 10.1016/j.actamat.2005.10.04510.1016/j.actamat.2005.10.045 ↗
26. 10.1007/978-3-0348-9148-6_310.1007/978-3-0348-9148-6_3 ↗
27. 10.1016/j.softx.2020.10043010.1016/j.softx.2020.100430 ↗
28. https://mooseframework.inl.gov/(accessed: March 2020).
29. 10.1016/j.commatsci.2011.07.02810.1016/j.commatsci.2011.07.028 ↗
30. 10.1016/j.actamat.2004.12.02610.1016/j.actamat.2004.12.026 ↗
31. 10.1103/PhysRevB.78.02411310.1103/PhysRevB.78.024113 ↗
32. 10.1016/S1359-6454(99)00418-810.1016/S1359-6454(99)00418-8 ↗
33. 10.1007/s10853-015-9107-910.1007/s10853-015-9107-9 ↗
34. 10.1023/A:100866380449510.1023/A:1008663804495 ↗
35. K.Ahmed Doctoral Dissertation Purdue University 2015.
36. A.Kunwar M. R.Tonks S.Shang X.Song Y.Wang H.Ma in2017 18th Inter. Conf. on Electronic Packaging Technology (ICEPT) IEEE Piscataway NJ2017 pp.1502–1507.10.1109/ICEPT.2017.8046720 ↗
37. 10.1016/j.commatsci.2015.12.04210.1016/j.commatsci.2015.12.042 ↗
38. 10.1016/S0921-5093(97)00437-110.1016/S0921-5093(97)00437-1 ↗