The kinetics of film growth and their influence on the susceptibility to pitting of copper in aqueous sulphide solutions

The formation of copper sulphide films on copper in aqueous sulphide solutions has been investigated under both natural corrosion and electrochemical conditions. Film growth occurs at the Cu2S/electrolyte interface and involves Cu+ transport through a generally porous film. Both corrosion and anodic film growth are suppressed by high chloride concentrations. Passivity, a pre-requisite for pitting, is achievable only at high sulphide concentrations and transport fluxes, conditions not expected under most geologic repository conditions since both sulphide groundwater concentrations and diffusive transport rates are expected to be low.This paper is part of a supplement on the 6th International Workshop on Long-Term Prediction of Corrosion Damage in Nuclear Waste Systems.